EEPROM, 256X16, Serial, CMOS, PDSO8, 4.40 MM, LEAD FREE AND HALOGEN FREE, MO-153AA, TSSOP-8
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Parts packaging code | TSSOP |
| package instruction | TSSOP, TSSOP8,.25 |
| Contacts | 8 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Other features | ALSO OPERATES AT 4.5V TO 5.5V SUPPLY |
| Spare memory width | 8 |
| Maximum clock frequency (fCLK) | 1 MHz |
| Data retention time - minimum | 100 |
| Durability | 1000000 Write/Erase Cycles |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e3 |
| length | 4.4 mm |
| memory density | 4096 bit |
| Memory IC Type | EEPROM |
| memory width | 16 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 256 words |
| character code | 256 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| organize | 256X16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP8,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Serial bus type | MICROWIRE |
| Maximum standby current | 0.00001 A |
| Maximum slew rate | 0.002 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| width | 3 mm |
| Maximum write cycle time (tWC) | 10 ms |
| write protect | SOFTWARE |
| Base Number Matches | 1 |
| AT93C66A-10TQ-2.7 | AT93C56AY1-10YU-2.7 | AT93C66A-W1.8-11 | AT93C56A-10TQ-2.7 | |
|---|---|---|---|---|
| Description | EEPROM, 256X16, Serial, CMOS, PDSO8, 4.40 MM, LEAD FREE AND HALOGEN FREE, MO-153AA, TSSOP-8 | EEPROM, 128X16, Serial, CMOS, 4.90 X 3 MM, LEAD AND HALOGEN FREE, MSOP-8 | EEPROM, 256X16, Serial, CMOS, DIE | EEPROM, 128X16, Serial, CMOS, PDSO8, 4.40 MM, LEAD FREE AND HALOGEN FREE, MO-153AA, TSSOP-8 |
| Parts packaging code | TSSOP | MSOP | DIE | TSSOP |
| package instruction | TSSOP, TSSOP8,.25 | HVSON, | DIE, | TSSOP, TSSOP8,.25 |
| Reach Compliance Code | compliant | compliant | unknown | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Spare memory width | 8 | 8 | 8 | 8 |
| Maximum clock frequency (fCLK) | 1 MHz | 1 MHz | 0.25 MHz | 1 MHz |
| JESD-30 code | R-PDSO-G8 | R-XDSO-N8 | X-XUUC-N | R-PDSO-G8 |
| memory density | 4096 bit | 2048 bit | 4096 bit | 2048 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 16 | 16 | 16 | 16 |
| Number of functions | 1 | 1 | 1 | 1 |
| word count | 256 words | 128 words | 256 words | 128 words |
| character code | 256 | 128 | 256 | 128 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 125 °C | 85 °C | 85 °C | 125 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 256X16 | 128X16 | 256X16 | 128X16 |
| Package body material | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY |
| encapsulated code | TSSOP | HVSON | DIE | TSSOP |
| Package shape | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | UNCASED CHIP | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Serial bus type | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | 1.8 V | 2.7 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 2.7 V | 5 V |
| surface mount | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE |
| Terminal form | GULL WING | NO LEAD | NO LEAD | GULL WING |
| Terminal location | DUAL | DUAL | UPPER | DUAL |
| Maximum write cycle time (tWC) | 10 ms | 10 ms | 10 ms | 10 ms |
| Is it Rohs certified? | conform to | conform to | - | conform to |
| Contacts | 8 | 8 | - | 8 |
| Other features | ALSO OPERATES AT 4.5V TO 5.5V SUPPLY | - | IT CAN ALSO CONFIGURABLE AS 256 X 8 | ALSO OPERATES AT 4.5V TO 5.5V SUPPLY |
| JESD-609 code | e3 | e3 | - | e3 |
| length | 4.4 mm | 4.9 mm | - | 4.4 mm |
| Humidity sensitivity level | 1 | 1 | - | 1 |
| Number of terminals | 8 | 8 | - | 8 |
| Peak Reflow Temperature (Celsius) | 260 | 260 | - | 260 |
| Maximum seat height | 1.2 mm | 0.9 mm | - | 1.2 mm |
| Terminal surface | Matte Tin (Sn) | MATTE TIN | - | Matte Tin (Sn) |
| Terminal pitch | 0.65 mm | 0.65 mm | - | 0.65 mm |
| Maximum time at peak reflow temperature | 40 | 40 | - | 40 |
| width | 3 mm | 3 mm | - | 3 mm |
| Maker | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
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