256X8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3 X 3 MM, ROHS COMPLIANT, TSSOP-8
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Parts packaging code | SOIC |
| package instruction | 3 X 3 MM, ROHS COMPLIANT, TSSOP-8 |
| Contacts | 8 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum clock frequency (fCLK) | 0.4 MHz |
| Data retention time - minimum | 40 |
| Durability | 1000000 Write/Erase Cycles |
| I2C control byte | 1010DDDR |
| JESD-30 code | S-PDSO-G8 |
| JESD-609 code | e3 |
| length | 3 mm |
| memory density | 2048 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 256 words |
| character code | 256 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 256X8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP8,.19 |
| Package shape | SQUARE |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 2.5/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.1 mm |
| Serial bus type | I2C |
| Maximum standby current | 5e-7 A |
| Maximum slew rate | 0.002 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2.2 V |
| Nominal supply voltage (Vsup) | 2.5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | MATTE TIN |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 3 mm |
| Maximum write cycle time (tWC) | 10 ms |
| write protect | HARDWARE/SOFTWARE |
| Base Number Matches | 1 |
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