Memory Circuit, 1MX16, CMOS, PBGA63, 8 X 10 MM, 1.40 MM HEIGHT, MO-210, LFBGA-63
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Parts packaging code | BGA |
package instruction | LFBGA, |
Contacts | 63 |
Reach Compliance Code | unknown |
Other features | SRAM IS ORGANIZED AS 256K X 16 |
JESD-30 code | R-PBGA-B63 |
length | 10 mm |
memory density | 16777216 bit |
Memory IC Type | MEMORY CIRCUIT |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 63 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -20 °C |
organize | 1MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 1.4 mm |
Maximum supply voltage (Vsup) | 3.3 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 8 mm |
Base Number Matches | 1 |