M68AW256ML70ZH1F datasheet, PDF

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M68AW256ML70ZH1F: Description4 Mbit (256K x16) 3.0V Asynchronous SRAM; Categorystorage storage; File Size147KB，23 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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M68AW256ML70ZH1F Overview

4 Mbit (256K x16) 3.0V Asynchronous SRAM

M68AW256ML70ZH1F Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	BGA
package instruction	6 X 8 MM, 0.75 MM PITCH, LEAD FREE, TFBGA-48
Contacts	48
Reach Compliance Code	compli
ECCN code	3A991.B.2.A
Maximum access time	70 ns
I/O type	COMMON
JESD-30 code	R-PBGA-B48
JESD-609 code	e1
length	8 mm
memory density	4194304 bi
Memory IC Type	STANDARD SRAM
memory width	16
Number of functions	1
Number of terminals	48
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA48,6X8,30
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.000009 A
Minimum standby current	1.5 V
Maximum slew rate	0.02 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	6 mm

M68AW256ML70ZH1F Preview

M68AW256M

4 Mbit (256K x16) 3.0V Asynchronous SRAM

FEATURES SUMMARY

■

SUPPLY VOLTAGE: 2.7 to 3.6V

256K x 16 bits SRAM with OUTPUT ENABLE

EQUAL CYCLE and ACCESS TIME: 55ns,

70ns

SINGLE BYTE READ/WRITE

LOW STANDBY CURRENT

LOW V

DATA RETENTION: 1.5V

TRI-STATE COMMON I/O

AUTOMATIC POWER DOWN

TSOP44, and TFBGA48 PACKAGES

– Compliant with Lead-Free Soldering Pro-

cesses

– Standard or Lead-Free Option

Figure 1. Packges

TSOP44 Type II (ND)

FBGA

TFBGA48 (ZH)

6 x 8mm

FBGA

TFBGA48 (ZB)

7 x 8mm

April 2004

1/23

M68AW256M

TABLE OF CONTENTS

FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Figure 1. Packges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Figure 2.

Table 1.

Figure 3.

Figure 4.

Figure 5.

Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

TFBGA Connections (Top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Output Disabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Write Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Standby/Power-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 2. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 3. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 4. Operating and AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Figure 6. AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Figure 7. AC Measurement Load Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 5. Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Table 6. DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Figure 8. Address Controlled, Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Figure 9. Chip Enable or Output Enable Controlled, Read Mode AC Waveforms.. . . . . . . . . . . . . 12

Figure 10.Chip Enable or UB/LB Controlled, Standby Mode AC Waveforms . . . . . . . . . . . . . . . . . 12

Table 7. Read and Standby Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 11.Write Enable Controlled, Write AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 12.Chip Enable Controlled, Write AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 13.UB/LB Controlled, Write AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Table 8. Write Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 14.Low V

Data Retention AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Table 9. Low V

Data Retention Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Figure 15.TSOP44 II - 44 lead Plastic Thin Small Outline Type II, Package Outline . . . . . . . . . . . 18

Table 10. TSOP 44 II - 44 lead Plastic Thin Small Outline Type II, Package Mechanical Data . . . 18

Figure 16.TFBGA48 6x8mm - 6x8 active ball array, 0.75 mm pitch, Bottom View Package Outline19

Table 11. TFBGA48 6x8mm - 6x8 active ball array, 0.75 mm pitch, Package Mechanical Data . . 19

Figure 17.TFBGA48 7x8mm - 6x8 ball array, 0.75 mm pitch, Bottom View Package Outline. . . . . 20

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M68AW256M

Table 12. TFBGA48 7x8mm - 6x8 ball array, 0.75 mm pitch, Package Mechanical Data. . . . . . . . 20

PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Table 13. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Table 14. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

3/23

M68AW256M

SUMMARY DESCRIPTION

The M68AW256M is a 4 Mbit (4,194,304 bit)

CMOS SRAM, organized as 262,144 words by 16

bits. The device features fully static operation re-

quiring no external clocks or timing strobes, with

equal address access and cycle times. It requires

a single 2.7 to 3.6V supply. This device has an au-

tomatic power-down feature, reducing the power

consumption by over 99% when deselected.

The M68AW256 is available in TFBGA48 (6x8mm

- 6x8 active ball array, 0.75mm pitch), TFBGA48

(7x8mm - 6x8 active ball array, 0.75 mm pitch) and

in TSOP44 Type II packages.

In addition to the standard version, both packages

are also available in Lead-free version, in compli-

ance with the JEDEC Std J-STD-020B, the ST

ECOPACK 7191395 Specification, and the RoHS

(Restriction of Hazardous Substances) directive.

All packages are compliant with Lead-free solder-

ing processes.

Figure 2. Logic Diagram

VCC

Table 1. Signal Names

A0-A17

DQ0-DQ15

Address Inputs

Data Input/Output

Chip Enable

Output Enable

Write Enable

Upper Byte Enable Input

Lower Byte Enable Input

Supply Voltage

Ground

Not Connected Internally

Don’t Use as Internally Connected

A0-A17

DQ0-DQ15

M68AW256M

VSS

AI04870b

4/23

M68AW256M

Figure 3. TSOP Connections

DQ0

DQ1

DQ2

DQ3

VCC

VSS

DQ4

DQ5

DQ6

DQ7

A16

A15

A14

A13

A12

M68AW256M

AI04871b

DQ15

DQ14

DQ13

DQ12

VSS

VCC

DQ11

DQ10

DQ9

DQ8

A10

A11

A17

5/23

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Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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