NAND04GW3B2DZL1F datasheet, PDF

NAND04GW3B2DZL1F: Description512KX8 FLASH 3V PROM, 20ns, PBGA52, 12 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, LGA-52; Categorystorage storage; File Size1MB，69 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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NAND04GW3B2DZL1F Overview

512KX8 FLASH 3V PROM, 20ns, PBGA52, 12 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, LGA-52

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	LGA
package instruction	12 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, LGA-52
Contacts	52
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	20 ns
command user interface	YES
Data polling	NO
JESD-30 code	R-PBGA-B52
JESD-609 code	e3/e4
length	17 mm
memory density	4194304 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of departments/size	4K
Number of terminals	52
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX8
Package body material	PLASTIC/EPOXY
encapsulated code	VBGA
Encapsulate equivalent code	LGA52(UNSPEC)
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE
page size	2K words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	0.65 mm
Department size	128K
Maximum standby current	0.00005 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN/NICKEL PALLADIUM GOLD
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
switch bit	NO
type	NAND TYPE
width	12 mm
Base Number Matches	1

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