Low-Power Battery Backup Circuits in Small レDFN Packages
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Maxim |
| package instruction | SON, SOLCC10,.08,16 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Is Samacsys | N |
| JESD-30 code | R-PDSO-N10 |
| JESD-609 code | e3 |
| Humidity sensitivity level | 1 |
| Number of terminals | 10 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SON |
| Encapsulate equivalent code | SOLCC10,.08,16 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 2.5/5 V |
| Certification status | Not Qualified |
| Maximum supply current (Isup) | 0.05 mA |
| surface mount | YES |
| technology | BICMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.4 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Base Number Matches | 1 |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD