1MX16 MASK PROM, 90ns, PDSO44, 15.24 MM, LEAD FREE, PLASTIC, SOP-44
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Parts packaging code | SOIC |
package instruction | 15.24 MM, LEAD FREE, PLASTIC, SOP-44 |
Contacts | 44 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 90 ns |
Spare memory width | 8 |
JESD-30 code | R-PDSO-G44 |
JESD-609 code | e6 |
length | 27.83 mm |
memory density | 16777216 bit |
Memory IC Type | MASK ROM |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 44 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | -10 °C |
organize | 1MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP44,.63 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3/3.3 V |
Certification status | Not Qualified |
Maximum seat height | 3 mm |
Maximum standby current | 0.00003 A |
Maximum slew rate | 0.03 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | MOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN BISMUTH |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 13.24 mm |
Base Number Matches | 1 |
UPD23C16000BLGX-XXX-A | UPD23C16000BLGY-XXX-MJH-A | UPD23C16000BLGY-XXX-MKH | UPD23C16000BLGY-XXX-MKH-A | |
---|---|---|---|---|
Description | 1MX16 MASK PROM, 90ns, PDSO44, 15.24 MM, LEAD FREE, PLASTIC, SOP-44 | 1MX16 MASK PROM, 90ns, PDSO48, 12 X 18 MM, LEAD FREE, PLASTIC, TSOP1-48 | 1MX16 MASK PROM, 90ns, PDSO48, 12 X 18 MM, PLASTIC, REVERSE, TSOP1-48 | 1MX16 MASK PROM, 90ns, PDSO48, 12 X 18 MM, LEAD FREE, PLASTIC, REVERSE, TSOP1-48 |
Parts packaging code | SOIC | TSOP1 | TSOP1 | TSOP1 |
package instruction | 15.24 MM, LEAD FREE, PLASTIC, SOP-44 | TSOP1, | TSOP1-R, | TSOP1-R, |
Contacts | 44 | 48 | 48 | 48 |
Reach Compliance Code | compliant | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 90 ns | 90 ns | 90 ns | 90 ns |
Spare memory width | 8 | 8 | 8 | 8 |
JESD-30 code | R-PDSO-G44 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 |
JESD-609 code | e6 | e3/e6 | e0 | e3/e6 |
length | 27.83 mm | 16.4 mm | 16.4 mm | 16.4 mm |
memory density | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
Memory IC Type | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
memory width | 16 | 16 | 16 | 16 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 44 | 48 | 48 | 48 |
word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
character code | 1000000 | 1000000 | 1000000 | 1000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
Minimum operating temperature | -10 °C | -10 °C | -10 °C | -10 °C |
organize | 1MX16 | 1MX16 | 1MX16 | 1MX16 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | TSOP1 | TSOP1-R | TSOP1-R |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 3 mm | 1.2 mm | 1.2 mm | 1.2 mm |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
Nominal supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V |
surface mount | YES | YES | YES | YES |
technology | MOS | MOS | MOS | MOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | TIN BISMUTH | MATTE TIN/TIN BISMUTH | TIN LEAD | MATTE TIN/TIN BISMUTH |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 0.5 mm | 0.5 mm | 0.5 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 13.24 mm | 12 mm | 12 mm | 12 mm |
Is it Rohs certified? | conform to | conform to | - | conform to |
Maker | - | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |