EEPROM, 64X16, Serial, CMOS, 3 X 3 MM, TDFN-8
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Parts packaging code | DFN |
package instruction | SON, SOLCC8,.2,25 |
Contacts | 8 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Spare memory width | 8 |
Maximum clock frequency (fCLK) | 0.5 MHz |
Data retention time - minimum | 100 |
Durability | 1000000 Write/Erase Cycles |
JESD-30 code | S-XDSO-N8 |
JESD-609 code | e0 |
memory density | 1024 bit |
Memory IC Type | EEPROM |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 64 words |
character code | 64 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 105 °C |
Minimum operating temperature | -40 °C |
organize | 64X16 |
Package body material | UNSPECIFIED |
encapsulated code | SON |
Encapsulate equivalent code | SOLCC8,.2,25 |
Package shape | SQUARE |
Package form | SMALL OUTLINE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | 240 |
power supply | 3/5 V |
Certification status | Not Qualified |
Serial bus type | MICROWIRE |
Maximum standby current | 0.00001 A |
Maximum slew rate | 0.003 mA |
Maximum supply voltage (Vsup) | 6 V |
Minimum supply voltage (Vsup) | 2.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | NO LEAD |
Terminal pitch | 0.635 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
write protect | SOFTWARE |
Base Number Matches | 1 |