Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds
Symbol
R
qJC
T
L
Max
2.0
260
Unit
°C/W
°C
ELECTRICAL CHARACTERISTICS
(T
J
= 25°C unless otherwise noted.)
Characteristic
OFF CHARACTERISTICS
Peak Repetitive Forward or Reverse Blocking Current
T
J
= 25°C
(V
AK
= Rated V
DRM
or V
RRM
, Gate Open)
T
J
= 125°C
ON CHARACTERISTICS
Peak Forward On-State Voltage (Note 2)
(I
TM
= 16 A Peak)
Gate Trigger Current (Continuous dc)
(V
D
= 12 V, R
L
= 100 Ohms)
Gate Trigger Voltage (Continuous dc)
(V
D
= 12 V, R
L
= 100 Ohms)
Gate Non−Trigger Voltage
(Rated 12 V, R
L
= 100 Ohms, T
J
= 125°C)
Holding Current
(V
D
= 12 Vdc, Initiating Current = 200 mA, Gate Open)
DYNAMIC CHARACTERISTICS
Critical Rate-of-Rise of Off-State Voltage
(V
D
= Rated V
DRM
, Exponential Waveform, Gate Open, T
J
= 125°C)
2. Pulse Test: Pulse Width = 1.0 ms, Duty Cycle
≤
2%.
dv/dt
−
100
−
V/ms
V
TM
I
GT
V
GT
V
GD
I
H
−
−
−
0.2
−
1.5
10
−
−
16
1.8
25
1.5
−
30
V
mA
V
V
mA
I
DRM
, I
RRM
−
−
−
−
10
2.0
mA
mA
Symbol
Min
Typ
Max
Unit
Voltage Current Characteristic of SCR
+ Current
Anode +
V
TM
Symbol
V
DRM
I
DRM
V
RRM
I
RRM
V
TM
I
H
Parameter
Peak Repetitive Off State Forward Voltage
Peak Forward Blocking Current
Peak Repetitive Off State Reverse Voltage
Peak Reverse Blocking Current
Peak On State Voltage
Holding Current
Reverse Blocking Region
(off state)
Reverse Avalanche Region
Anode −
I
RRM
at V
RRM
on state
I
H
+ Voltage
I
DRM
at V
DRM
Forward Blocking Region
(off state)
http://onsemi.com
2
MCR218−2, MCR218−4, MCR218−6
°
TC , MAXIMUM ALLOWABLE CASE TEMPERATURE ( C)
P(AV), AVERAGE ON-STATE POWER DISSIPATION
(WATTS)
125
15
115
α
α
= CONDUCTION ANGLE
12
α
α
= Conduction Angle
120°
180°
60°
α
= 30°
90°
dc
105
9.0
95
dc
α
= 30°
0
1
2
6.0
85
75
60°
3
90° 120°
4
180°
5
6
7
3.0
0
0
1.0
2.0
3.0
4.0
5.0
6.0
I
T(AV)
, AVG. ON-STATE CURRENT (AMPS)
7.0
8.0
8
I
T(AV)
, AVERAGE ON-STATE FORWARD CURRENT (AMPS)
Figure 1. Current Derating
Figure 2. On−State Power Dissipation
I GT , NORMALIZED GATE TRIGGER CURRENT (mA)
2.0
V
D
= 12 Vdc
1.5
1.0
0.9
0.7
0.5
0.4
0.3
−60
−40
−20
0
20
40
60
80
100
120
140
V GT , NORMALIZED GATE TRIGGER VOLTAGE
3.0
1.3
1.2
V
D
= 12 Vdc
1.0
0.9
0.7
0.5
0.4
0.3
−60
−40
−20
0
20
40
60
80
100
120
140
T
J
, JUNCTION TEMPERATURE (°C)
T
J
, JUNCTION TEMPERATURE (°C)
Figure 3. Typical Gate Trigger Current
versus Temperature
Figure 4. Typical Gate Trigger Voltage
versus Temperature
I H , NORMALIZED HOLDING CURRENT (mA)
4.0
3.0
2.0
V
D
= 12 Vdc
1.5
1.0
0.9
0.7
0.5
0.4
−60
−40
−20
0
20
40
60
80
100
120
140
T
J
, JUNCTION TEMPERATURE (°C)
Figure 5. Typical Holding Current
versus Temperature
http://onsemi.com
3
MCR218−2, MCR218−4, MCR218−6
PACKAGE DIMENSIONS
TO−220AB
CASE 221A−07
ISSUE AA
−T−
B
F
C
SEATING
PLANE
T
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
V
Z
INCHES
MIN
MAX
0.570
0.620
0.380
0.405
0.160
0.190
0.025
0.035
0.142
0.147
0.095
0.105
0.110
0.155
0.014
0.022
0.500
0.562
0.045
0.060
0.190
0.210
0.100
0.120
0.080
0.110
0.045
0.055
0.235
0.255
0.000
0.050
0.045
−−−
−−− 0.080
CATHODE
ANODE
GATE
ANODE
MILLIMETERS
MIN
MAX
14.48
15.75
9.66
10.28
4.07
4.82
0.64
0.88
3.61
3.73
2.42
2.66
2.80
3.93
0.36
0.55
12.70
14.27
1.15
1.52
4.83
5.33
2.54
3.04
2.04
2.79
1.15
1.39
5.97
6.47
0.00
1.27
1.15
−−−
−−−
2.04
4
Q
1 2 3
A
U
K
H
Z
L
V
G
D
N
J
R
STYLE 3:
PIN 1.
2.
3.
4.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support:
800−282−9855 Toll Free
Literature Distribution Center for ON Semiconductor
USA/Canada
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone:
480−829−7710 or 800−344−3860 Toll Free USA/Canada
Japan:
ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051