IC 8-BIT, MROM, 5 MHz, MICROCONTROLLER, PQCC68, PLASTIC, LCC-68, Microcontroller
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Parts packaging code | LCC |
package instruction | QCCJ, LDCC68,1.0SQ |
Contacts | 68 |
Reach Compliance Code | not_compliant |
Is Samacsys | N |
Has ADC | YES |
Address bus width | 16 |
bit size | 8 |
CPU series | TMS370 |
maximum clock frequency | 20 MHz |
DAC channel | NO |
DMA channel | NO |
External data bus width | 8 |
JESD-30 code | S-PQCC-J68 |
length | 24.23 mm |
Number of I/O lines | 55 |
Number of terminals | 68 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
PWM channel | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC68,1.0SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
RAM (bytes) | 3584 |
rom(word) | 49152 |
ROM programmability | MROM |
Maximum seat height | 4.57 mm |
speed | 5 MHz |
Maximum slew rate | 55 mA |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 4.5 V |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 24.23 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
Base Number Matches | 1 |
TMS370C069AFNL | TMS370C067AFNL | TMS370C067AFNA | TMS370C068AFNA | TMS370C068AFNT | |
---|---|---|---|---|---|
Description | IC 8-BIT, MROM, 5 MHz, MICROCONTROLLER, PQCC68, PLASTIC, LCC-68, Microcontroller | 8-BIT, MROM, 5MHz, MICROCONTROLLER, PQCC68, PLASTIC, LCC-68 | 8-BIT, MROM, 5MHz, MICROCONTROLLER, PQCC68, PLASTIC, LCC-68 | 8-BIT, MROM, 5MHz, MICROCONTROLLER, PQCC68, PLASTIC, LCC-68 | 8-BIT, MROM, 5MHz, MICROCONTROLLER, PQCC68, PLASTIC, LCC-68 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | LCC | LCC | LCC | LCC | LCC |
package instruction | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ |
Contacts | 68 | 68 | 68 | 68 | 68 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
Has ADC | YES | YES | YES | YES | YES |
Address bus width | 16 | 16 | 16 | 16 | 16 |
bit size | 8 | 8 | 8 | 8 | 8 |
CPU series | TMS370 | TMS370 | TMS370 | TMS370 | TMS370 |
maximum clock frequency | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
DAC channel | NO | NO | NO | NO | NO |
DMA channel | NO | NO | NO | NO | NO |
External data bus width | 8 | 8 | 8 | 8 | 8 |
JESD-30 code | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 |
length | 24.23 mm | 24.23 mm | 24.23 mm | 24.23 mm | 24.23 mm |
Number of I/O lines | 55 | 55 | 55 | 55 | 55 |
Number of terminals | 68 | 68 | 68 | 68 | 68 |
Maximum operating temperature | 70 °C | 70 °C | 85 °C | 85 °C | 105 °C |
Minimum operating temperature | - | - | -40 °C | -40 °C | -40 °C |
PWM channel | YES | YES | YES | YES | YES |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
Encapsulate equivalent code | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM (bytes) | 3584 | 1024 | 1024 | 1024 | 1024 |
rom(word) | 49152 | 24576 | 24576 | 32768 | 32768 |
ROM programmability | MROM | MROM | MROM | MROM | MROM |
Maximum seat height | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm |
speed | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz |
Maximum slew rate | 55 mA | 56 mA | 56 mA | 56 mA | 56 mA |
Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | J BEND | J BEND | J BEND | J BEND | J BEND |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 24.23 mm | 24.23 mm | 24.23 mm | 24.23 mm | 24.23 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |