M38002E2SS datasheet, PDF - EEWORLD Datasheet

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M38002E2SS: DescriptionMicrocontroller, 8-Bit, UVPROM, 8MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，33 Pages; ManufacturerMitsubishi; Websitehttp://www.mitsubishielectric.com/semiconductors/

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M38002E2SS Overview

Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64

M38002E2SS Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	SHRINK, CERAMIC, DIP-64
Contacts	64
Reach Compliance Code	unknown
Is Samacsys	N
Has ADC	NO
Address bus width	16
bit size	8
boundary scan	NO
maximum clock frequency	8 MHz
DAC channel	NO
DMA channel	NO
External data bus width	8
Format	FIXED POINT
Integrated cache	NO
JESD-30 code	R-CDIP-T64
low power mode	YES
Number of DMA channels
Number of external interrupt devices	8
Number of I/O lines	58
Number of serial I/Os	1
Number of terminals	64
Number of timers	4
On-chip data RAM width	8
On-chip program ROM width	8
Maximum operating temperature	85 °C
Minimum operating temperature	-20 °C
PWM channel	NO
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WSDIP
Package shape	RECTANGULAR
Package form	IN-LINE, WINDOW, SHRINK PITCH
Certification status	Not Qualified
RAM (number of words)	384
rom(word)	8192
ROM programmability	UVPROM
Maximum seat height	5.35 mm
speed	8 MHz
Maximum slew rate	13 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	3 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	OTHER
Terminal form	THROUGH-HOLE
Terminal pitch	1.778 mm
Terminal location	DUAL
width	19.05 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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M38002E2SS Related Products

	M38002E2SS	M38007E4SS	M38007E4FS	M38003E6FS	M38003E6FP	M38003E6SS	M38003E6SP	M38002E2FS
Description	Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64	Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64	Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, CQCC64, CERAMIC, LCC-64	Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, CQCC64, CERAMIC, LCC-64	Microcontroller, 8-Bit, OTPROM, 8MHz, CMOS, PQFP64, PLASTIC, QFP-64	Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64	Microcontroller, 8-Bit, OTPROM, 8MHz, CMOS, PDIP64, 1.778 MM PITCH, SHRINK, PLASTIC, DIP-64	Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, CQCC64, CERAMIC, LCC-64
Parts packaging code	DIP	DIP	LCC	LCC	QFP	DIP	DIP	LCC
package instruction	SHRINK, CERAMIC, DIP-64	SHRINK, CERAMIC, DIP-64	CERAMIC, LCC-64	CERAMIC, LCC-64	PLASTIC, QFP-64	SHRINK, CERAMIC, DIP-64	1.778 MM PITCH, SHRINK, PLASTIC, DIP-64	CERAMIC, LCC-64
Contacts	64	64	64	64	64	64	64	64
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Has ADC	NO	NO	NO	NO	NO	NO	NO	NO
Address bus width	16	16	16	16	16	16	16	16
bit size	8	8	8	8	8	8	8	8
boundary scan	NO	NO	NO	NO	NO	NO	NO	NO
maximum clock frequency	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz
DAC channel	NO	NO	NO	NO	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO	NO	NO	NO	NO
External data bus width	8	8	8	8	8	8	8	8
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	NO	NO	NO	NO	NO	NO	NO	NO
JESD-30 code	R-CDIP-T64	R-CDIP-T64	S-CQCC-N64	S-CQCC-N64	S-PQFP-G64	R-CDIP-T64	R-PDIP-T64	S-CQCC-N64
low power mode	YES	YES	YES	YES	YES	YES	YES	YES
Number of external interrupt devices	8	8	8	8	8	8	8	8
Number of I/O lines	58	58	58	58	58	58	58	58
Number of serial I/Os	1	1	1	1	1	1	1	1
Number of terminals	64	64	64	64	64	64	64	64
Number of timers	4	4	4	4	4	4	4	4
On-chip data RAM width	8	8	8	8	8	8	8	8
On-chip program ROM width	8	8	8	8	8	8	8	8
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C
PWM channel	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WSDIP	WSDIP	WQCCN	WQCCN	QFP	WSDIP	SDIP	WQCCN
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE
Package form	IN-LINE, WINDOW, SHRINK PITCH	IN-LINE, WINDOW, SHRINK PITCH	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW	FLATPACK	IN-LINE, WINDOW, SHRINK PITCH	IN-LINE, SHRINK PITCH	CHIP CARRIER, WINDOW
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (number of words)	384	512	512	512	512	512	512	384
rom(word)	8192	8192	8192	24576	24576	24576	24576	8192
ROM programmability	UVPROM	UVPROM	UVPROM	UVPROM	OTPROM	UVPROM	OTPROM	UVPROM
Maximum seat height	5.35 mm	5.35 mm	3.13 mm	3.13 mm	3.05 mm	5.35 mm	5.5 mm	3.13 mm
speed	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz
Maximum slew rate	13 mA	13 mA	13 mA	13 mA	13 mA	13 mA	13 mA	13 mA
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES	YES	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal form	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD	GULL WING	THROUGH-HOLE	THROUGH-HOLE	NO LEAD
Terminal pitch	1.778 mm	1.778 mm	0.8 mm	0.8 mm	0.8 mm	1.778 mm	1.778 mm	0.8 mm
Terminal location	DUAL	DUAL	QUAD	QUAD	QUAD	DUAL	DUAL	QUAD
width	19.05 mm	19.05 mm	15.6 mm	15.6 mm	14 mm	19.05 mm	19.05 mm	15.6 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Maker	-	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi
length	-	-	15.6 mm	15.6 mm	14 mm	-	56.4 mm	15.6 mm

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