Field Programmable Gate Array, 10570-Cell, CMOS, PBGA672, 35 X 35 MM, 1.27 MM PITCH, BGA-672
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | BGA |
package instruction | BGA, BGA672,26X26,50 |
Contacts | 672 |
Reach Compliance Code | compliant |
ECCN code | 3A991 |
Is Samacsys | N |
JESD-30 code | S-PBGA-B672 |
JESD-609 code | e0 |
Number of entries | 426 |
Number of logical units | 10570 |
Output times | 426 |
Number of terminals | 672 |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA672,26X26,50 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 1.5,1.5/3.3 V |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Maximum supply voltage | 1.575 V |
Minimum supply voltage | 1.425 V |
Nominal supply voltage | 1.5 V |
surface mount | YES |
technology | CMOS |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 1.27 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Base Number Matches | 1 |
EP1S10B672I7 | EP1S80F1508I6 | |
---|---|---|
Description | Field Programmable Gate Array, 10570-Cell, CMOS, PBGA672, 35 X 35 MM, 1.27 MM PITCH, BGA-672 | Field Programmable Gate Array, 79040-Cell, CMOS, PBGA1508, 40 X 40 MM, 1 MM PITCH, FBGA-1508 |
Is it lead-free? | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible |
Parts packaging code | BGA | BGA |
package instruction | BGA, BGA672,26X26,50 | BGA, BGA1508,39X39,40 |
Contacts | 672 | 1508 |
Reach Compliance Code | compliant | compliant |
ECCN code | 3A991 | 3A001.A.7.A |
Is Samacsys | N | N |
JESD-30 code | S-PBGA-B672 | S-PBGA-B1508 |
JESD-609 code | e0 | e0 |
Number of entries | 426 | 1238 |
Number of logical units | 10570 | 79040 |
Output times | 426 | 1238 |
Number of terminals | 672 | 1508 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | BGA | BGA |
Encapsulate equivalent code | BGA672,26X26,50 | BGA1508,39X39,40 |
Package shape | SQUARE | SQUARE |
Package form | GRID ARRAY | GRID ARRAY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
power supply | 1.5,1.5/3.3 V | 1.5,1.5/3.3 V |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified | Not Qualified |
Maximum supply voltage | 1.575 V | 1.575 V |
Minimum supply voltage | 1.425 V | 1.425 V |
Nominal supply voltage | 1.5 V | 1.5 V |
surface mount | YES | YES |
technology | CMOS | CMOS |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | BALL | BALL |
Terminal pitch | 1.27 mm | 1 mm |
Terminal location | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
Base Number Matches | 1 | 1 |