SRAM Module, 2MX8, 70ns, CMOS
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | APTA Group Inc |
package instruction | DIP, DIP44,1.9 |
Reach Compliance Code | unknown |
ECCN code | 3A991.B.2.A |
Is Samacsys | N |
Maximum access time | 70 ns |
Spare memory width | 16 |
I/O type | COMMON |
JESD-30 code | R-XDMA-T44 |
JESD-609 code | e0 |
memory density | 16777216 bit |
Memory IC Type | SRAM MODULE |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 44 |
word count | 2097152 words |
character code | 2000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 2MX8 |
Output characteristics | 3-STATE |
Package body material | UNSPECIFIED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP44,1.9 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum standby current | 0.002 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.187 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Base Number Matches | 1 |