CMM-5-BD-000V datasheet, PDF - EEWORLD Datasheet

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CMM-5-BD-000V: DescriptionWide Band Low Power Amplifier, 2000MHz Min, 6000MHz Max, 0.039 X 0.040 INCH, ROHS COMPLIANT, CHIP; CategoryWireless rf/communication Radio frequency and microwave; File Size1MB，5 Pages; ManufacturerMACOM; Websitehttp://www.macom.com; Environmental Compliance

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CMM-5-BD-000V Overview

Wide Band Low Power Amplifier, 2000MHz Min, 6000MHz Max, 0.039 X 0.040 INCH, ROHS COMPLIANT, CHIP

CMM-5-BD-000V Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	MACOM
Reach Compliance Code	compliant
Is Samacsys	N
structure	COMPONENT
Gain	15 dB
Maximum input power (CW)	20 dBm
JESD-609 code	e3
Number of functions	1
Maximum operating frequency	6000 MHz
Minimum operating frequency	2000 MHz
RF/Microwave Device Types	WIDE BAND LOW POWER
Terminal surface	Matte Tin (Sn)
Maximum voltage standing wave ratio	1.8
Base Number Matches	1

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2.0-6.0 GHz

GaAs MMIC Amplifier

January 2007 - Rev 15-Jan-07

CMM-5-BD

Chip Diagram

Features

High Gain: 16.5 dB

18 dBm P1dB

Small Size: 39x40 mils

Directly Cascadable

Self-Biased

Single Power Supply

General Description

Mimix Broadband's CMM-5 is a 2 to 6 GHz GaAs MMIC

amplifier. It is a two-stage feedback design which provides

high gain and good power from a single power supply.

Applications include oscillator buffers, RF and IF gain blocks

and driver amplifiers.

The CMM-5 is a very small chip which provides 16.5 dB of

gain and 18 dBm of power from a 6 volt supply. The chip is

directly cascadable with no additional components. The

circuit’s self-biasing feature provides excellent performance

from a 5 to 7 volt supply. Care must be taken to isolate the

input from the external DC voltages.

Mimix MMICs are fabricated on ion-implanted GaAs material

with gold-based metalization. The FET gates are sub-half

micron, tee cross-section construction. Air bridges are used

for top level interconnection. Silicon nitride serves as

capacitor dielectric and surface passivation. Mesa resistors

are used for feedback and bias function.

The CMM-5 is available in chip form. It can be screened to

meet commercial, military Hi-Rel or space grade reliability

requirements. Custom wafer qualification for special

electrical and/or reliability requirements is also available.

Absolute Maximum Ratings

Voltage

Continuous Power Dissipation

Channel Temperature

Storage Temperature

Mounting Temperature

Input Power

1.25 W

+175 ºC

-65 to +175

+320 ºC

+20 dBm

60 ºC/W

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Page 1 of 5

Characteristic Data and Specifications are subject to change without notice.

Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

2.0-6.0 GHz

GaAs MMIC Amplifier

January 2007 - Rev 15-Jan-07

CMM-5-BD

Handling and Assembly Information

CAUTION!

- Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the

environment. For safety, observe the following procedures:

• Do not ingest.

• Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical

processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed.

• Observe government laws and company regulations when discarding this product. This product must be

discarded in accordance with methods specified by applicable hazardous waste procedures.

Life Support Policy

- Mimix Broadband's products are not authorized for use as critical components in life support devices or

systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1) Life

support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain

life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be

reasonably expected to result in a significant injury to the user. (2) A critical component is any component of a life support device or

system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its

safety or effectiveness.

ESD

- Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic

containers, which should be opened in cleanroom conditions at an appropriately grounded antistatic workstation. Devices need

careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers.

Die Attachment

- GaAs Products from Mimix Broadband are 0.076 mm (0.003") thick and have vias through to the backside to enable

grounding to the circuit. Microstrip substrates should be brought as close to the die as possible. The mounting surface should be

clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in

a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the die.

An epoxy fillet should be visible around the total die periphery. For additional information please see the Mimix "Epoxy Specifications

for Bare Die" application note. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.001

thick,

placed between the die and the attachment surface should be used. A die bonder that utilizes a heated collet and provides scrubbing

action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic

(80% Au 20% Sn) has a melting point of approximately 280º C (Note: Gold Germanium should be avoided). The work station

temperature should be 310ºC +/- 10ºC. Exposure to these extreme temperatures should be kept to minimum. The collet should be

heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical during

placement.

Wire Bonding

- Windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond

pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99% pure gold ribbon with 0.5-2%

elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for DC Bias

connections. Aluminum wire should be avoided. Thermo-compression bonding is recommended though thermosonic bonding may

be used providing the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters. Bonds

should be made from the bond pads on the die to the package or substrate. All bonds should be as short as possible.

RoHS Compliant Parts

- All Mimix products are RoHS compliant unless specifically ordered with Tin-Lead finish.

Part Number for Ordering

CMM-5-BD-000X

Description

Where “X” is RoHS compliant die packed in “V” - vacuum release gel packs or

W” - waffle trays

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Page 5 of 5

Characteristic Data and Specifications are subject to change without notice.

Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

CMM-5-BD-000V Related Products

	CMM-5-BD-000V	CMM-5-BD-000W
Description	Wide Band Low Power Amplifier, 2000MHz Min, 6000MHz Max, 0.039 X 0.040 INCH, ROHS COMPLIANT, CHIP	Wide Band Low Power Amplifier, 2000MHz Min, 6000MHz Max, 0.039 X 0.040 INCH, ROHS COMPLIANT, CHIP
Is it lead-free?	Lead free	Lead free
Is it Rohs certified?	conform to	conform to
Maker	MACOM	MACOM
Reach Compliance Code	compliant	compliant
structure	COMPONENT	COMPONENT
Gain	15 dB	15 dB
Maximum input power (CW)	20 dBm	20 dBm
JESD-609 code	e3	e3
Number of functions	1	1
Maximum operating frequency	6000 MHz	6000 MHz
Minimum operating frequency	2000 MHz	2000 MHz
RF/Microwave Device Types	WIDE BAND LOW POWER	WIDE BAND LOW POWER
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)
Maximum voltage standing wave ratio	1.8	1.8

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