MCM6257BP10 datasheet, PDF - EEWORLD Datasheet

MCM6257BP10: DescriptionIC,DRAM,NIBBLE MODE,256KX1,MOS,DIP,16PIN,PLASTIC; Categorystorage storage; File Size731KB，12 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MCM6257BP10 Overview

IC,DRAM,NIBBLE MODE,256KX1,MOS,DIP,16PIN,PLASTIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Is Samacsys	N
Maximum access time	100 ns
I/O type	SEPARATE
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
memory density	262144 bit
Memory IC Type	NIBBLE MODE DRAM
memory width	1
Number of terminals	16
word count	262144 words
character code	256000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX1
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
refresh cycle	256
Maximum slew rate	0.08 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	MOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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