MMBZ5221BW - MMBZ5259BW
200mW SURFACE MOUNT ZENER DIODE
Features
•
•
•
•
•
Small Surface Mount Package
Ideally Suited for Automated Assembly Processes
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
•
•
•
•
•
•
Case: SOT323
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
e3
Polarity: See Diagram
Weight: 0.006 grams (approximate)
Top View
Device Schematic
Ordering Information
Device
(Type Number)-7-F*
(Note 4)
Packaging
SOT323
Shipping
3000/Tape & Reel
* Add “-7-F” to the appropriate type number in Electrical Characteristics Table from Page 2. Example: 6.2V Zener = MMBZ5234BW-7-F.
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4.
For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
(Note 5)
xxx = Product Type Marking Code
(See Electrical Characteristics Table)
YM = Date Code Marking
Y = Year (ex: B = 2014)
M = Month (ex: 9 = September)
2011
Y
May
5
2012
Z
Jun
6
2013
A
Jul
7
2014
B
Aug
8
2015
C
Sep
9
2016
D
Oct
O
2017
E
Nov
N
2018
F
Dec
D
xxx
Date Code Key
Year
Code
Month
Code
Note:
2007
U
Jan
1
2008
V
Feb
2
2009
W
Mar
3
2010
X
Apr
4
5. Product manufactured with date code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to date
code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
YM
MMBZ5221BW - MMBZ5259BW
Document number: DS31037 Rev. 14 - 2
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February 2014
© Diodes Incorporated
MMBZ5221BW - MMBZ5259BW
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Forward Voltage
@ I
F
= 10mA
Symbol
V
F
Value
0.9
Unit
V
Thermal Characteristics
Characteristic
Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient Air (Note 6)
Operating and Storage Temperature Range
Notes:
Symbol
P
D
R
θ
JA
T
J,
T
STG
Value
200
625
-65 to +150
Unit
mW
°C/W
°C
6. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Zener Voltage Range (Note 7)
Type
Number
MMBZ5221BW
MMBZ5223BW
MMBZ5225BW
MMBZ5226BW
MMBZ5227BW
MMBZ5228BW
MMBZ5229BW
MMBZ5230BW
MMBZ5231BW
MMBZ5232BW
MMBZ5233BW
MMBZ5234BW
MMBZ5235BW
MMBZ5236BW
MMBZ5237BW
MMBZ5238BW
MMBZ5239BW
MMBZ5240BW
MMBZ5241BW
MMBZ5242BW
MMBZ5243BW
MMBZ5245BW
MMBZ5246BW
MMBZ5248BW
MMBZ5250BW
MMBZ5251BW
MMBZ5252BW
MMBZ5254BW
MMBZ5255BW
MMBZ5256BW
MMBZ5257BW
MMBZ5258BW
MMBZ5259BW
Notes:
Test Current
I
ZT
Marking
Code
KC1
KC3
KC5
KG1
KG2
KG3
KG4
KG5
KE1
KE2
KE3
KE4
KE5
KF1
KF2
KF3
KF4
KF5
KH1
KH2
KH3
KH5
KJ1
KJ3
KJ5
KK1
KK2
KK4
KK5
KM1
KM2
KM3
KM4
Nom (V)
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6
6.2
6.8
7.5
8.2
8.7
9.1
10
11
12
13
15
16
18
20
22
24
27
28
30
33
36
39
V
Z
@ I
ZT
Min (V)
2.28
2.57
2.85
3.14
3.42
3.71
4.09
4.47
4.85
5.32
5.70
5.89
6.46
7.13
7.79
8.27
8.65
9.50
10.45
11.40
12.35
14.25
15.20
17.10
19.00
20.90
22.80
25.65
26.60
28.50
31.35
34.20
37.05
Max (V)
2.52
2.84
3.15
3.47
3.78
4.10
4.52
4.94
5.36
5.88
6.30
6.51
7.14
7.88
8.61
9.14
9.56
10.50
11.55
12.60
13.65
15.75
16.80
18.90
21.00
23.10
25.20
28.35
29.40
31.50
34.65
37.80
40.95
mA
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
9.5
8.5
7.8
7.0
6.2
5.6
5.2
5.0
4.5
4.2
3.8
3.4
3.2
Maximum Zener Impedance
(Note 8)
Z
ZK
@ I
ZK
Z
ZT
@ I
ZT
= 0.25mA
Ω
30
1200
30
1300
30
1600
28
1600
24
1700
23
1900
22
2000
19
1900
17
1600
11
1600
7.0
1600
7.0
1000
5.0
750
6.0
500
8.0
500
8
600
10
600
17
600
22
600
30
600
13
600
16
600
17
600
21
600
25
600
29
600
33
600
41
600
44
600
49
600
58
700
70
700
80
800
Maximum Reverse
Leakage Current (Note 7)
I
R
μA
100
75
50
25
15
10
5.0
5.0
5.0
5.0
5.0
5.0
3.0
3.0
3.0
3
3.0
3.0
2.0
1.0
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
@ V
R
V
1.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
2.0
3.0
3.5
4.0
5.0
6.0
6.5
6.5
7.0
8.0
8.4
9.1
9.9
11
12
14
15
17
18
21
21
23
25
27
30
7. Short duration pulse test used to minimize self-heating effect.
8. f = 1KHz.
MMBZ5221BW - MMBZ5259BW
Document number: DS31037 Rev. 14 - 2
2 of 5
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February 2014
© Diodes Incorporated
MMBZ5221BW - MMBZ5259BW
0.4
Note 6
50
P
D
, POWER DISSIPATION (W)
40
0.3
I
Z
, ZENER CURRENT (mA)
30
0.2
20
0.1
10
0
0
0
100
125
25
50
75
T
A
, AMBIENT TEMPERATURE (
°
C)
Fig. 1 Power Derating Curve
T
j
= 25°C
10
12
150
0
3
4
5
6
8
9 10
7
V
Z
, ZENER VOLTAGE (V)
Fig. 2 Typical Zener Breakdown Characteristics
1
2
30
1,000
T
j
= 25 °C
f = 1MHz
20
Test current I
Z
15
Nominal Zener Voltage
C
T
, TOTAL CAPACITANCE (pF)
I
Z
, ZENER CURRENT (mA)
18
100
V
R
= 1V
10
22
27
33
36
39
V
R
= 2V
0
0
10
20
30
40
V
Z
, ZENER VOLTAGE (V)
Fig. 3 Typical Zener Breakdown Characteristics
10
10
100
V
Z
, NOMINAL ZENER VOLTAGE (V)
Fig. 4 Typical Total Capacitance vs. Nominal Zener Voltage
1
1,000
100
100
P
PK
, PEAK SURGE POWER (W)
Z
Z
, ZENER IMPEDANCE (
Ω
)
10
10
1
1
1
10
100
V
Z
, ZENER VOLTAGE (V)
Fig. 5 Typical Zener Impedence Characteristics
1
1,000
10
100
PULSE WIDTH (ms)
Fig. 6 Maximum Non-repetitive Surge Power
MMBZ5221BW - MMBZ5259BW
Document number: DS31037 Rev. 14 - 2
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February 2014
© Diodes Incorporated
MMBZ5221BW - MMBZ5259BW
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A
B C
G
H
K
M
J
D
L
SOT323
Dim
Min
Max
Typ
A
0.25
0.40
0.30
B
1.15
1.35
1.30
C
2.00
2.20
2.10
D
-
-
0.65
G
1.20
1.40
1.30
H
1.80
2.20
2.15
J
0.0
0.10
0.05
K
0.90
1.00
1.00
L
0.25
0.40
0.30
M
0.10
0.18
0.11
0°
8°
-
α
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for latest version.
Y
Z
C
Dimensions Value (in mm)
Z
2.8
X
0.7
Y
0.9
C
1.9
E
1.0
X
E
MMBZ5221BW - MMBZ5259BW
Document number: DS31037 Rev. 14 - 2
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
MMBZ5221BW - MMBZ5259BW
Document number: DS31037 Rev. 14 - 2
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February 2014
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