32-BIT, 667MHz, MICROPROCESSOR, PBGA783, 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
Parameter Name | Attribute value |
Objectid | 2142876350 |
Parts packaging code | BGA |
package instruction | BGA, |
Contacts | 783 |
Reach Compliance Code | unknown |
ECCN code | 3A991.A.2 |
YTEOL | 0 |
Address bus width | 64 |
bit size | 32 |
boundary scan | YES |
maximum clock frequency | 166 MHz |
External data bus width | 64 |
Format | FIXED POINT |
Integrated cache | YES |
JESD-30 code | S-PBGA-B783 |
length | 29 mm |
low power mode | YES |
Number of terminals | 783 |
Maximum operating temperature | 105 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Certification status | Not Qualified |
Maximum seat height | 3.85 mm |
speed | 667 MHz |
Maximum supply voltage | 1.26 V |
Minimum supply voltage | 1.14 V |
Nominal supply voltage | 1.2 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
width | 29 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |