32-BIT, 1000MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 1.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360
| Parameter Name | Attribute value |
| Maker | NXP |
| Parts packaging code | LGA |
| package instruction | CGA, |
| Contacts | 360 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.3 |
| Is Samacsys | N |
| Other features | LOW POWER TAKEN FROM SLEEP MODE |
| Address bus width | 36 |
| bit size | 32 |
| boundary scan | YES |
| maximum clock frequency | 200 MHz |
| External data bus width | 64 |
| Format | FLOATING POINT |
| Integrated cache | YES |
| JESD-30 code | S-CBGA-X360 |
| length | 25 mm |
| low power mode | YES |
| Number of terminals | 360 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | CGA |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Certification status | Not Qualified |
| Maximum seat height | 1.8 mm |
| speed | 1000 MHz |
| Maximum supply voltage | 1.2 V |
| Minimum supply voltage | 1.1 V |
| Nominal supply voltage | 1.15 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | UNSPECIFIED |
| Terminal pitch | 1.27 mm |
| Terminal location | BOTTOM |
| width | 25 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
| Base Number Matches | 1 |
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