32-BIT, 533 MHz, RISC PROCESSOR, PBGA783
| Parameter Name | Attribute value |
| External data bus width | 64 |
| Number of terminals | 783 |
| Minimum operating temperature | 0.0 Cel |
| Maximum operating temperature | 105 Cel |
| Line speed | 533 MHz |
| Processing package description | 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783 |
| state | Active |
| microprocessor_microcontroller_peripheral_ic_type | MICROPROCESSOR, RISC |
| Address bus width | 64 |
| Number of digits | 32 |
| boundary scan | YES |
| clock_frequency_max | 166 MHz |
| form | FLOATING POINT |
| Integrated cache | YES |
| jesd_30_code | R-PBGA-B783 |
| jesd_609_code | e2 |
| low power mode | YES |
| moisture_sensitivity_level | 3 |
| Packaging Materials | PLASTIC/EPOXY |
| ckage_code | HBGA |
| packaging shape | RECTANGULAR |
| Package Size | GRID ARRAY, HEAT SINK/SLUG |
| eak_reflow_temperature__cel_ | 260 |
| qualification_status | COMMERCIAL |
| seated_height_max | 3.75 mm |
| Rated supply voltage | 1.2 V |
| Minimum supply voltage | 1.14 V |
| Maximum supply voltage | 1.26 V |
| surface mount | YES |
| Craftsmanship | CMOS |
| Temperature level | OTHER |
| terminal coating | TIN COPPER/TIN SILVER |
| Terminal form | BALL |
| Terminal spacing | 1 mm |
| Terminal location | BOTTOM |
| ime_peak_reflow_temperature_max__s_ | 40 |
| length | 29 mm |
| width | 29 mm |
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