HEF4066BDF datasheet, PDF - EEWORLD Datasheet

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HEF4066BDF: DescriptionIC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP14, CERAMIC, DIP-14, Multiplexer or Switch; CategoryAnalog mixed-signal IC The signal circuit; File Size86KB，8 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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HEF4066BDF Overview

IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP14, CERAMIC, DIP-14, Multiplexer or Switch

HEF4066BDF Parametric

Parameter Name	Attribute value
Maker	NXP
Parts packaging code	DIP
package instruction	CERAMIC, DIP-14
Contacts	14
Reach Compliance Code	unknown
Is Samacsys	N
Analog Integrated Circuits - Other Types	SPST
JESD-30 code	R-GDIP-T14
Nominal Negative Supply Voltage (Vsup)
Number of channels	1
Number of functions	4
Number of terminals	14
Nominal off-state isolation	50 dB
On-state resistance matching specifications	5 Ω
Maximum on-state resistance (Ron)	175 Ω
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum seat height	5.08 mm
Nominal supply voltage (Vsup)	15 V
surface mount	NO
Maximum disconnect time	140 ns
Maximum connection time	30 ns
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

HEF4066BDF Related Products

	HEF4066BDF	933372970653	933372970652	HEF4066BTD	933296650652	HEF4066BD	935260050118	935260050112
Description	IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP14, CERAMIC, DIP-14, Multiplexer or Switch	IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO14, PLASTIC, SOT-108, SO-14, Multiplexer or Switch	IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO14, PLASTIC, SOT-108, SO-14, Multiplexer or Switch	IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO14, PLASTIC, SO-14, Multiplexer or Switch	QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14, PLASTIC, SOT-27, DIP-14	IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP14, CERAMIC, DIP-14, Multiplexer or Switch	IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO14, PLASTIC, SOT-108, SO-14, Multiplexer or Switch	IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO14, PLASTIC, SOT-108, SO-14, Multiplexer or Switch
Parts packaging code	DIP	SOIC	SOIC	SOIC	DIP	DIP	SOIC	SOIC
package instruction	CERAMIC, DIP-14	SOP,	SOP,	SOP,	DIP,	CERAMIC, DIP-14	PLASTIC, SOT-108, SO-14	PLASTIC, SOT-108, SO-14
Contacts	14	14	14	14	14	14	14	14
Reach Compliance Code	unknown	unknow	unknow	compliant	unknown	unknown	unknown	unknown
Analog Integrated Circuits - Other Types	SPST	SPST	SPST	SPST	SPST	SPST	SPST	SPST
JESD-30 code	R-GDIP-T14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDIP-T14	R-GDIP-T14	R-PDSO-G14	R-PDSO-G14
Number of channels	1	1	1	1	1	1	1	1
Number of functions	4	4	4	4	4	4	4	4
Number of terminals	14	14	14	14	14	14	14	14
Nominal off-state isolation	50 dB	50 dB	50 dB	50 dB	50 dB	50 dB	50 dB	50 dB
On-state resistance matching specifications	5 Ω	5 Ω	5 Ω	5 Ω	5 Ω	5 Ω	5 Ω	5 Ω
Maximum on-state resistance (Ron)	175 Ω	175 Ω	175 Ω	175 Ω	175 Ω	175 Ω	175 Ω	175 Ω
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	SOP	SOP	DIP	DIP	SOP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	1.75 mm	1.75 mm	1.75 mm	4.2 mm	5.08 mm	1.75 mm	1.75 mm
Nominal supply voltage (Vsup)	15 V	15 V	15 V	15 V	15 V	15 V	15 V	15 V
surface mount	NO	YES	YES	YES	NO	NO	YES	YES
Maximum disconnect time	140 ns	140 ns	140 ns	140 ns	140 ns	140 ns	140 ns	140 ns
Maximum connection time	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	7.62 mm	3.9 mm	3.9 mm	3.9 mm	7.62 mm	7.62 mm	3.9 mm	3.9 mm
Maker	NXP	-	-	NXP	NXP	NXP	NXP	NXP
Base Number Matches	1	1	1	1	1	1	-	-
Is it lead-free?	-	Lead free	Lead free	-	Lead free	-	Lead free	Lead free
Is it Rohs certified?	-	conform to	conform to	conform to	conform to	-	conform to	conform to
JESD-609 code	-	e4	e4	-	e4	-	e4	e4
length	-	8.65 mm	8.65 mm	8.65 mm	19.025 mm	-	8.65 mm	8.65 mm
Peak Reflow Temperature (Celsius)	-	260	260	260	245	-	NOT SPECIFIED	NOT SPECIFIED
Terminal surface	-	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	-	NICKEL PALLADIUM GOLD	-	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD
Maximum time at peak reflow temperature	-	30	30	40	40	-	NOT SPECIFIED	NOT SPECIFIED

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