Math Processor, MOS, CDIP24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Intel |
| package instruction | DIP, DIP24,.6 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5,12 V |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | MOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| MC8231A | C8231-8 | C8231A3 | MC8231 | MC8231A8/B | MC8231A/B | MC8231/B | |
|---|---|---|---|---|---|---|---|
| Description | Math Processor, MOS, CDIP24 | Math Processor, MOS, CDIP24 | Math Processor, MOS, CDIP24 | Math Processor, MOS, CDIP24 | Math Processor, MOS, CDIP24 | Math Processor, MOS, CDIP24 | Math Processor, MOS, CDIP24 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| package instruction | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Is Samacsys | N | N | N | N | N | N | N |
| JESD-30 code | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | - | - | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5,12 V | 5,12 V | 5,12 V | 5,12 V | 5,12 V | 5,12 V | 5,12 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | NO | NO | NO | NO |
| technology | MOS | MOS | MOS | MOS | MOS | MOS | MOS |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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