NAND01GR4B2CN6E datasheet, PDF

NAND01GR4B2CN6E: Description256M X 8 FLASH 3V PROM, 25000 ns, PDSO48; Categorystorage storage; File Size506KB，62 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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NAND01GR4B2CN6E Overview

256M X 8 FLASH 3V PROM, 25000 ns, PDSO48

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	TSOP
package instruction	12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48
Contacts	48
Reach Compliance Code	compli
ECCN code	3A991.B.1.A
Is Samacsys	N
Maximum access time	25000 ns
JESD-30 code	R-PDSO-G48
JESD-609 code	e3
length	18.4 mm
memory density	1073741824 bi
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of terminals	48
word count	67108864 words
character code	64000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Programming voltage	1.8 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
type	NAND TYPE
width	12 mm
Base Number Matches	1

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