2N2222AU datasheet, PDF - EEWORLD Datasheet

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2N2222AU: DescriptionSmall Signal Bipolar Transistor, 0.8A I(C), 50V V(BR)CEO, 1-Element, NPN, Silicon, DIE PACKAGE-3; CategoryDiscrete semiconductor The transistor; File Size39KB，2 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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2N2222AU Overview

Small Signal Bipolar Transistor, 0.8A I(C), 50V V(BR)CEO, 1-Element, NPN, Silicon, DIE PACKAGE-3

2N2222AU Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Objectid	2129149998
Parts packaging code	DIE
package instruction	UNCASED CHIP, S-XUUC-N3
Contacts	3
Reach Compliance Code	compliant
ECCN code	EAR99
YTEOL	0
Shell connection	COLLECTOR
Maximum collector current (IC)	0.8 A
Collector-emitter maximum voltage	50 V
Configuration	SINGLE
Minimum DC current gain (hFE)	100
JESD-30 code	S-XUUC-N3
Number of components	1
Number of terminals	3
Maximum operating temperature	200 °C
Package body material	UNSPECIFIED
Package shape	SQUARE
Package form	UNCASED CHIP
Polarity/channel type	NPN
Certification status	Not Qualified
surface mount	YES
Terminal form	NO LEAD
Terminal location	UPPER
transistor applications	SWITCHING
Transistor component materials	SILICON
Maximum off time (toff)	300 ns
Maximum opening time (tons)	45 ns

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2N2222A DIE

A Microsemi Company

580 Pleasant St.

Watertown, MA 02172

Phone: 617-924-9280

Fax: 617-924-1235

DIE SPECIFICATION

SWITCHING TRANSISTOR

NPN SILICON

FEATURES:

ELECTRICAL PERFORMANCE I.A.W. MIL-PRF-19500/255

AVAILABLE IN WAFER OR CHIP FORM FOR HYBRID APPLICATIONS

GENERAL PURPOSE-HIGH SPEED SWITCHING APPLICATIONS

LOW VCE(sat): .3V @ IC = 150 mAdc

PHYSICAL DIMENSIONS

Absolute Maximum Ratings:

Symbol

Vceo

Vcbo

Vebo

Tj, Tstg

Parameter

Collector-Emitter Voltage

Collector-Base Voltage

Emitter-Base Voltage

Collector Current- Continuous

Operating Junction & Storage

Temperature Range

Limit

6.0

800

-65 to +200

Unit

Vdc

mAdc

°C

Packaging Options:

W: Wafer (100% probed) U: Wafer (sample probed)

D: Chip (Waffle Pack)

B: Chip (Vial)

V: Chip (Waffle Pack, 100% visually inspected) X: Other

Metallization Options:

Standard: Al Top

Dash 1:

Al Top

/ Au Backside (No Dash #)

/ TiPdAg Backside

Processing Options:

Standard: Capable of JANTXV applications (No Suffix)

Suffix C: Commercial

Suffix S: Capable of S-Level equivalent applications

ORDERING INFORMATION:

PART #: 2N2222A_ _ - _

First Suffix Letter: Packaging Option

Second Suffix Letter: Processing Option

Dash #: Metallization Option

Sertech reserves the right to make changes to any product design, specification, or other information at any time without

prior notice.

Data Sheet, Die, 2N2222A MSW Rev. - 4/15/98

MSC0949.PDF

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