Interface Circuit, 1-Trnsvr, CMOS, PQCC56, 8 X 8 MM, PLASTIC, M0-220VLLD-5, MLF2-56
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DFN |
| package instruction | HVQCCN, LCC56,.31SQ,20 |
| Contacts | 56 |
| Manufacturer packaging code | MLF |
| Reach Compliance Code | not_compliant |
| data rate | 100000 Mbps |
| JESD-30 code | S-PQCC-N56 |
| JESD-609 code | e0 |
| length | 8 mm |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 56 |
| Transceiver quantity | 1 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HVQCCN |
| Encapsulate equivalent code | LCC56,.31SQ,20 |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 1 mm |
| Maximum slew rate | 0.16 mA |
| Nominal supply voltage | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Telecom integrated circuit types | INTERFACE CIRCUIT |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn85Pb15) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 8 mm |
| Base Number Matches | 1 |
| ICS1893CKI | ICS1893CK | ICS1893CFILFT | ICS1893CFILF | ICS1893CKIT | ICS1893CKT | |
|---|---|---|---|---|---|---|
| Description | Interface Circuit, 1-Trnsvr, CMOS, PQCC56, 8 X 8 MM, PLASTIC, M0-220VLLD-5, MLF2-56 | Interface Circuit, 1-Trnsvr, CMOS, PQCC56, 8 X 8 MM, PLASTIC, M0-220VLLD-5, MLF2-56 | Interface Circuit, 1-Trnsvr, CMOS, PDSO48, 0.300 MM INCH, LEAD FREE, SSOP-48 | Interface Circuit, 1-Trnsvr, CMOS, PDSO48, 0.300 MM INCH, LEAD FREE, SSOP-48 | Interface Circuit, 1-Trnsvr, CMOS, PQCC56, 8 X 8 MM, PLASTIC, M0-220VLLD-5, MLF2-56 | Interface Circuit, 1-Trnsvr, CMOS, PQCC56, 8 X 8 MM, PLASTIC, M0-220VLLD-5, MLF2-56 |
| Is it Rohs certified? | incompatible | incompatible | conform to | conform to | incompatible | incompatible |
| Parts packaging code | DFN | DFN | SSOP | SSOP | DFN | DFN |
| package instruction | HVQCCN, LCC56,.31SQ,20 | HVQCCN, LCC56,.31SQ,20 | 0.300 MM INCH, LEAD FREE, SSOP-48 | 0.300 MM INCH, LEAD FREE, SSOP-48 | HVQCCN, LCC56,.31SQ,20 | HVQCCN, LCC56,.31SQ,20 |
| Contacts | 56 | 56 | 48 | 48 | 56 | 56 |
| Reach Compliance Code | not_compliant | _compli | unknown | unknown | not_compliant | not_compliant |
| data rate | 100000 Mbps | 100000 Mbps | 100000 Mbps | 100000 Mbps | 100000 Mbps | 100000 Mbps |
| JESD-30 code | S-PQCC-N56 | S-PQCC-N56 | R-PDSO-G48 | R-PDSO-G48 | S-PQCC-N56 | S-PQCC-N56 |
| JESD-609 code | e0 | e0 | e3 | e3 | e0 | e0 |
| length | 8 mm | 8 mm | 15.875 mm | 15.875 mm | 8 mm | 8 mm |
| Humidity sensitivity level | 3 | 3 | 1 | 1 | 3 | 3 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 56 | 56 | 48 | 48 | 56 | 56 |
| Transceiver quantity | 1 | 1 | 1 | 1 | 1 | 1 |
| Maximum operating temperature | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C |
| Minimum operating temperature | -40 °C | - | -40 °C | -40 °C | -40 °C | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | HVQCCN | HVQCCN | SSOP | SSOP | HVQCCN | HVQCCN |
| Encapsulate equivalent code | LCC56,.31SQ,20 | LCC56,.31SQ,20 | SSOP48,.4 | SSOP48,.4 | LCC56,.31SQ,20 | LCC56,.31SQ,20 |
| Package shape | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 225 | 225 | 260 | 260 | 225 | 225 |
| power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1 mm | 1 mm | 2.8 mm | 2.8 mm | 1 mm | 1 mm |
| Maximum slew rate | 0.16 mA | 0.16 mA | 0.16 mA | 0.16 mA | 0.16 mA | 0.16 mA |
| Nominal supply voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Telecom integrated circuit types | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
| Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| Terminal form | NO LEAD | NO LEAD | GULL WING | GULL WING | NO LEAD | NO LEAD |
| Terminal pitch | 0.5 mm | 0.5 mm | 0.635 mm | 0.635 mm | 0.5 mm | 0.5 mm |
| Terminal location | QUAD | QUAD | DUAL | DUAL | QUAD | QUAD |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 |
| width | 8 mm | 8 mm | 7.5 mm | 7.5 mm | 8 mm | 8 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| Is it lead-free? | Contains lead | Contains lead | - | - | Contains lead | Contains lead |
| Manufacturer packaging code | MLF | MLF | - | - | MLF | MLF |
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