MX1N3037UR-1E3 datasheet, PDF - EEWORLD Datasheet

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MX1N3037UR-1E3: DescriptionZener Diode, 51V V(Z), 20%, 1.25W, Silicon, Unidirectional, DO-213AB, ROHS COMPLIANT, HERMETIC SEALED, LEADLESS, GLASS, MELF-2; CategoryDiscrete semiconductor diode; File Size161KB，3 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com; Environmental Compliance

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MX1N3037UR-1E3 Overview

Zener Diode, 51V V(Z), 20%, 1.25W, Silicon, Unidirectional, DO-213AB, ROHS COMPLIANT, HERMETIC SEALED, LEADLESS, GLASS, MELF-2

MX1N3037UR-1E3 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Microsemi
Parts packaging code	DO-213AB
package instruction	O-LELF-R2
Contacts	2
Reach Compliance Code	unknown
ECCN code	EAR99
Is Samacsys	N
Other features	METALLURGICALLY BONDED, HIGH RELIABILITY
Shell connection	ISOLATED
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
JEDEC-95 code	DO-213AB
JESD-30 code	O-LELF-R2
JESD-609 code	e3
Number of components	1
Number of terminals	2
Package body material	GLASS
Package shape	ROUND
Package form	LONG FORM
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
polarity	UNIDIRECTIONAL
Maximum power dissipation	1.25 W
Certification status	Not Qualified
Nominal reference voltage	51 V
surface mount	YES
technology	ZENER
Terminal surface	MATTE TIN
Terminal form	WRAP AROUND
Terminal location	END
Maximum time at peak reflow temperature	NOT SPECIFIED
Maximum voltage tolerance	20%
Working test current	5 mA
Base Number Matches	1

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1N3016BUR-1 thru 1N3051BUR-1, e3

(or MLL3016B thru MLL3051B, e3)

SCOTTSDALE DIVISION

Surface Mount 1.5 W

GLASS ZENER DIODES

DESCRIPTION

This surface mountable zener diode series is similar to the 1N3016 thru

1N3051 JEDEC registration in the DO-13 package except that it meets the

surface mount DO-213AB outline. It is an ideal selection for applications of

high density and low parasitic requirements. Due to its glass hermetic seal

qualities and metallurgically enhanced internal construction, it is also well

suited for high-reliability applications. This can be acquired by a source

control drawing (SCD), or by ordering device types with MQ, MX, or MV

prefix to part number for equivalent screening to JAN, JANTX or JANTXV.

APPEARANCE

WWW .

Microsemi

DO-213AB

IMPORTANT:

For the most current data, consult

MICROSEMI’s

website:

http://www.microsemi.com

FEATURES

•

Leadless surface mount package equivalents to the

JEDEC registered 1N3016 thru 1N3051 except with

higher power rating of 1.5 Watts

Ideal for high-density mounting

Voltage range: 6.8 to 200 volts

Hermetically sealed, double-slug glass construction

Metallurgically enhanced contact construction.

Options for screening in accordance with MIL-PRF-

19500/115 for JAN, JANTX, JANTXV, and JANS with

MQ, MX, MV, or MSP prefixes respectively for part

numbers, e.g. MX1N3016BUR-1, MV1N3051BUR-1,

etc.

Axial lead “thru-hole” DO-13 packages per JEDEC

registration available as 1N3016B thru 1N3051B (see

separate data sheet with MIL-PRF-19500/115

qualification)

RoHS Compliant devices available by adding “e3” suffix

•

APPLICATIONS / BENEFITS

Regulates voltage over a broad operating current

and temperature range

Wide selection from 6.8 to 200 V

Tight voltage tolerances available

Low reverse (leakage) currents

Leadless package for surface mounting

Ideal for high-density mounting

Metallurgically enhanced internal contact design for

greater reliability and lower thermal resistance

Nonsensitive to ESD

Hermetically sealed glass package

Specified capacitance (see Figure 2)

Inherently radiation hard as described in Microsemi

MicroNote 050

•

MAXIMUM RATINGS

•

Power dissipation at 25

C: 1.5 watts (also see

derating in Figure 1).

Operating and Storage temperature: -65

C to

+175

Thermal Resistance: 40

C/W junction to end cap,

or 120 C/W junction to ambient when mounted on

FR4 PC board (1 oz Cu) with recommended

footprint (see last page)

Steady-State Power: 1.50 watts at end-cap

temperature T

< 115

C, or 1.25 watts at T

= 25

when mounted on FR4 PC board and

recommended footprint as described for thermal

resistance (also see Figure 1)

Forward voltage @200 mA: 1.2 volts (maximum)

Solder Temperatures: 260 C for 10 s (max)

•

MECHANICAL AND PACKAGING

CASE: Hermetically sealed glass MELF package

TERMINALS: Tin-lead or RoHS compliant

annealed matte-Tin plating solderable per MIL-

STD-750, method 2026

POLARITY: Cathode indicated by band. Diode to

be operated with the banded end positive with

respect to the opposite end for Zener regulation

MARKING: Cathode band only

TAPE & REEL optional: Standard per EIA-481-1-A

with 12 mm tape, 1500 per 7 inch reel or 5000 per

13 inch reel (add “TR” suffix to part number)

WEIGHT: 0.05 grams

See package dimensions on last page

•

1N3016BUR-1, e3 thru

1N3051BUR-1, e3

•

2006

3-12-2006 REV D

Microsemi

Scottsdale Division

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

Page 1

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