NCP115
LDO Regulator
- High PSRR
300 mA
The NCP115 is 300 mA LDO that provides the engineer with a very
stable, accurate voltage with low noise suitable for space constrained,
noise sensitive applications. In order to optimize performance for
battery operated portable applications, the NCP115 employs the
dynamic quiescent current adjustment for very low I
Q
consumption at
no−load.
Features
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MARKING
DIAGRAMS
XDFN4
CASE 711AJ
XX M
1
•
Operating Input Voltage Range: 1.7 V to 5.5 V
•
Available in Fixed Voltage Options: 0.8 V to 3.6 V
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Contact Factory for Other Voltage Options
Very Low Quiescent Current of Typ. 50
mA
Soft Start Feature with Two V
OUT
Slew Rate Speed
Standby Current Consumption: Typ. 0.1
mA
Low Dropout: 250 mV Typical at 300 mA @ 2.8 V
±1%
Accuracy at Room Temperature
High Power Supply Ripple Rejection: 70 dB at 1 kHz
Thermal Shutdown and Current Limit Protections
Available in XDFN4 and TSOP−5 Packages
Stable with a 1
mF
Ceramic Output Capacitor
These are Pb−Free Devices
PDAs, Mobile phones, GPS, Smartphones
Wireless Handsets, Wireless LAN, Bluetooth
®
, Zigbee
®
Portable Medical Equipment
Other Battery Powered Applications
1
XX = Specific Device Code
M = Date Code
5
5
1
TSOP−5
CASE 483
1
XX M
G
G
XX
= Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
Typical Applicaitons
PIN CONNECTIONS
EN
3
IN
4
V
IN
IN
C
IN
ON
OFF
EN
NCP115
GND
OUT
C
OUT
1
mF
Ceramic
V
OUT
2
1
GND
OUT
(Bottom View)
Figure 1. Typical Application Schematic
IN
GND
EN
1
2
3
(Top View)
5 OUT
4 N/C
See detailed ordering, marking and shipping information on
page 15 of this data sheet.
ORDERING INFORMATION
©
Semiconductor Components Industries, LLC, 2017
September, 2019
−
Rev. 4
1
Publication Order Number:
NCP115/D
NCP115
IN
ENABLE
LOGIC
BANDGAP
REFERENCE
THERMAL
SHUTDOWN
MOSFET
DRIVER WITH
CURRENT LIMIT
OUT
EN
AUTO LOW
POWER MODE
ACTIVE
DISCHARGE*
EN
GND
*Active output discharge function is present only in NCP115A and NCP115C devices.
yyy denotes the particular V
OUT
option.
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
(XDFN4)
1
2
3
4
−
−
Pin No.
(TSOP5)
5
2
3
1
4
−
Pin Name
OUT
GND
EN
IN
N/C
EPAD
Description
Regulated output voltage pin. A small ceramic capacitor with minimum value of 1
mF
is need-
ed from this pin to ground to assure stability.
Power supply ground.
Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into
shutdown mode.
Input pin. A small capacitor is needed from this pin to ground to assure stability.
Not connected. This pin can be tied to ground to improve thermal dissipation.
Exposed pad should be connected directly to the GND pin. Soldered to a large ground cop-
per plane allows for effective heat removal.
ABSOLUTE MAXIMUM RATINGS
Rating
Input Voltage (Note 1)
Output Voltage
Enable Input
Output Short Circuit Duration
Maximum Junction Temperature
Storage Temperature
ESD Capability, Human Body Model (Note 2)
ESD Capability, Machine Model (Note 2)
Symbol
V
IN
V
OUT
V
EN
t
SC
T
J(MAX)
T
STG
ESD
HBM
ESD
MM
Value
−0.3
V to 6 V
−0.3
V to V
IN
+ 0.3 V or 6 V
−0.3
V to 6 V
∞
150
−55
to 150
2000
200
Unit
V
V
V
s
°C
°C
V
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114,
ESD Machine Model tested per EIA/JESD22−A115,
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS
(Note 3)
Rating
Thermal Characteristics, XDFN4 1x1 mm
Thermal Resistance, Junction−to−Air
Thermal Characteristics, TSOP−5
Thermal Resistance, Junction−to−Air
3. Single component mounted on 1 oz, FR 4 PCB with 645 mm
2
Cu area.
Symbol
R
qJA
R
qJA
Value
208
162
Unit
°C/W
°C/W
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2
NCP115
2.5 V, whichever is greater; I
OUT
= 1 mA, C
IN
= C
OUT
= 1
mF,
unless otherwise noted. V
EN
= 0.9 V. Typical values are at T
J
= +25°C.
Min./Max. are for T
J
=
−40°C
and T
J
= +85°C respectively (Note 4).
Parameter
Operating Input Voltage
Output Voltage Accuracy
−40°C
≤
T
J
≤
85°C
V
OUT
≤
2.0 V
V
OUT
> 2.0 V
Line Regulation
Load Regulation
−
XDFN4 package
Load Regulation
−
TSOP−5 package
Dropout Voltage
−
XDFN4 package
(Note 5)
I
OUT
= 300 mA
V
OUT
= 1.8 V
V
OUT
= 2.8 V
V
OUT
= 3.3 V
Dropout Voltage
−
TSOP−5 package
(Note 5)
I
OUT
= 300 mA
V
OUT
= 1.8 V
V
OUT
= 2.8 V
V
OUT
= 3.3 V
Output Current Limit
Quiescent Current
Shutdown Current
EN Pin Threshold Voltage
High Threshold
Low Threshold
V
OUT
Slew Rate (Note 6)
V
OUT
= 90% V
OUT(nom)
I
OUT
= 0 mA
V
EN
≤
0.4 V, V
IN
= 5.5 V
V
EN
Voltage increasing
V
EN
Voltage decreasing
V
OUT
= 3.3 V, I
OUT
= 10 mA
Normal (version
A and B)
Slow (version C
and D)
EN Pin Input Current
Power Supply Rejection Ratio
Output Noise Voltage
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
Active Output Discharge Resistance
V
EN
= 5.5 V
V
IN
= 3.8 V, V
OUT
= 3.5 V
I
OUT
= 10 mA
f = 10 Hz to 100 kHz
Temperature increasing from T
J
= +25°C
Temperature falling from T
SD
V
EN
< 0.4 V, Version A and C only
f = 1 kHz
I
EN
PSRR
V
N
T
SD
T
SDH
R
DIS
I
CL
I
Q
I
DIS
V
EN_HI
V
EN_LO
V
OUT_SR
0.9
190
20
0.3
70
70
160
20
100
1.0
mA
dB
mV
rms
°C
°C
W
300
V
DO
V
DO
V
OUT
+ 0.5 V
≤
V
IN
≤
5.5 V (V
IN
≥
1.7 V)
I
OUT
= 1 mA to 300 mA
Reg
LINE
Reg
LOAD
Test Conditions
Symbol
V
IN
V
OUT
Min
1.7
−40
−2
0.01
12
28
425
250
215
445
270
235
600
50
0.01
95
1
Typ
Max
5.5
+40
+2
0.1
30
45
560
320
260
580
340
280
mA
mA
mA
V
0.4
mV/ms
mV
mV
ELECTRICAL CHARACTERISTICS
−40°C
≤
T
J
≤
85°C; V
IN
= V
OUT(NOM)
+ 1 V for V
OUT
options greater than 1.5 V. Otherwise V
IN
=
Unit
V
mV
%
%/V
mV
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at
T
J
= T
A
= 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
5. Characterized when V
OUT
falls 100 mV below the regulated voltage at V
IN
= V
OUT(NOM)
+ 1 V.
6. Please refer OPN to determine slew rate. NCP115A, NCP115B
−
Normal speed. NCP115C, NCP115D
−
slower speed
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3
NCP115
TYPICAL CHARACTERISTICS
1.220
V
OUT
, OUTPUT VOLTAGE (V)
V
OUT
, OUTPUT VOLTAGE (V)
1.215
1.210
1.200
1.190
1.180
V
IN
= 2.5 V
V
OUT
= 1.2 V
C
IN
= 1
mF
C
OUT
= 1
mF
I
OUT
= 10 mA
1.205
1.195
I
OUT
= 300 mA
1.185
1.175
1.820
1.815
1.810
1.805
1.800
1.795
1.790
1.785
1.780
1.775
1.770
−40 −30 −20 −10
0
I
OUT
= 300 mA
V
IN
= 2.8 V
V
OUT
= 1.8 V
C
IN
= 1
mF
C
OUT
= 1
mF
I
OUT
= 10 mA
1.170
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
10 20 30 40 50 60 70 80 90
T
J
, JUNCTION TEMPERATURE (°C)
T
J
, JUNCTION TEMPERATURE (°C)
Figure 3. Output Voltage vs. Temperature
−
V
OUT
= 1.2 V
−
XDFN4
2.820
V
OUT
, OUTPUT VOLTAGE (V)
2.815
2.810
2.805
2.800
2.795
2.790
2.785
2.780
2.775
2.770
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
I
OUT
= 300 mA
V
IN
= 3.8 V
V
OUT
= 2.8 V
C
IN
= 1
mF
C
OUT
= 1
mF
I
OUT
= 10 mA
3.310
V
OUT
, OUTPUT VOLTAGE (V)
3.305
3.300
3.295
3.290
3.285
3.280
3.275
3.270
Figure 4. Output Voltage vs. Temperature
−
V
OUT
= 1.8 V
−
XDFN4
V
IN
= 4.3 V
V
OUT
= 3.3 V
C
IN
= 1
mF
C
OUT
= 1
mF
I
OUT
= 10 mA
I
OUT
= 300 mA
3.265
3.260
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
T
J
, JUNCTION TEMPERATURE (°C))
T
J
, JUNCTION TEMPERATURE (°C)
Figure 5. Output Voltage vs. Temperature
−
V
OUT
= 2.8 V
−
XDFN4
0.004
0.003
0.002
0.001
0
REG
LOAD
, LOAD REGULATION (mV)
0.005
REG
LINE
, LINE REGULATION (%/V)
V
OUT
= 1.2 V
V
OUT
= 1.8 V
V
OUT
= 2.8 V
V
OUT
= 3.3 V
V
IN
= V
OUT_NOM
+ 0.5 to 5.5 V
V
OUT
= 1.8 V
C
IN
= 1
mF
C
OUT
= 1
mF
10 20 30 40 50 60 70 80 90
20
18
16
14
12
10
8
Figure 6. Output Voltage vs. Temperature
−
V
OUT
= 3.3 V
−
XDFN4
V
OUT
= 2.8 V
V
OUT
= 3.3 V
V
OUT
= 1.2 V
V
OUT
= 1.8 V
−0.001
−0.002
−0.003
−0.004
−0.005
−40 −30 −20 −10
0
6 V =V
IN
OUT_NOM
+ 1 V
4 I
OUT
= 1 mA to 300 mA
C
IN
= 1
mF
2
C
OUT
= 1
mF
0
−40 −30 −20 −10
0 10 20 30 40 50 60 70 80 90
T
J
, JUNCTION TEMPERATURE (°C)
T
J
, JUNCTION TEMPERATURE (°C)
Figure 7. Line Regulation vs. Temperature
Figure 8. Load Regulation vs. Temperature
−
XDFN4
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4
NCP115
TYPICAL CHARACTERISTICS
600
500
400
300
200
100
0
I
Q
, QUIESCENT CURRENT (mA)
I
GND
, GROUND CURRENT (mA)
V
IN
= V
OUT_NOM
+ 1 V
C
IN
= 1
mF
C
OUT
= 1
mF
T
J
= 85°C
T
J
= 25°C
T
J
=
−40°C
70
63
56
49
42
35
28
21
14
7
0
V
IN
= 2.8 V
V
OUT
= 1.8 V
I
OUT
= 0 mA
C
IN
= 1
mF
C
OUT
= 1
mF
0
1
2
3
4
5
6
T
J
= 25°C
T
J
=
−40°C
T
J
= 85°C
0.001
0.01
0.1
1
10
100
1000
I
OUT
, OUTPUT CURRENT (mA)
V
IN
, INPUT VOLTAGE (V)
Figure 9. Ground Current vs. Load Current
500
V
DO
, DROPOUT VOLTAGE (mV)
450
400
350
300
250
200
150
100
50
0
T
J
= 25°C
T
J
=
−40°C
350
V
DROP
, DROPOUT VOLTAGE (mV)
315
280
245
210
175
140
105
70
35
0
Figure 10. Quiescent Current vs. Input Voltage
V
OUT
= 1.8 V
V
OUT
= 2.8 V
C
IN
= 1
mF
C
OUT
= 1
mF
meas for V
OUT_NOM
−
100 mV
V
OUT
= 1.8 V
C
IN
= 1
mF
C
OUT
= 1
mF
meas for V
OUT_NOM
−
100 mV
T
J
= 85°C
T
J
= 85°C
T
J
=
−40°C
T
J
= 25°C
0
50
100
150
200
250
300
0
50
100
150
200
250
300
I
OUT
, OUTPUT CURRENT (mA)
I
OUT
, OUTPUT CURRENT (mA)
Figure 11. Dropout Voltage vs. Load Current
−
V
OUT
= 1.8 V
300
V
DROP
, DROPOUT VOLTAGE (mV)
270
240
210
180
150
120
90
60
30
0
T
J
= 25°C
T
J
=
−40°C
I
CL
, CURRENT LIMIT (mA)
V
OUT
= 3.3 V
C
IN
= 1
mF
C
OUT
= 1
mF
meas for V
OUT_NOM
−
100 mV
T
J
= 85°C
720
700
680
660
640
620
600
580
560
Figure 12. Dropout Voltage vs. Load Current
−
V
OUT
= 2.8 V
0
50
100
150
200
250
300
540
520
−40 −30 −20 −10
0
V
IN
= 4.3 V
V
OUT
= 90% V
OUT(nom)
C
IN
= 1
mF
C
OUT
= 1
mF
10 20 30 40 50 60 70 80 90
I
OUT
, OUTPUT CURRENT (mA)
T
J
, JUNCTION TEMPERATURE (°C)
Figure 13. Dropout Voltage vs. Load Current
−
V
OUT
= 3.3 V
Figure 14. Current Limit vs. Temperature
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