TRANSISTOR 68.9 A, 30 V, 0.0177 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252, PLASTIC, SC-63, DPAK-3, FET General Purpose Power
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | NXP |
Parts packaging code | TO-252 |
package instruction | PLASTIC, SC-63, DPAK-3 |
Contacts | 3 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Is Samacsys | N |
Shell connection | DRAIN |
Configuration | SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage | 30 V |
Maximum drain current (Abs) (ID) | 68.9 A |
Maximum drain current (ID) | 68.9 A |
Maximum drain-source on-resistance | 0.0177 Ω |
FET technology | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95 code | TO-252 |
JESD-30 code | R-PSSO-G2 |
JESD-609 code | e3 |
Humidity sensitivity level | 1 |
Number of components | 1 |
Number of terminals | 2 |
Operating mode | ENHANCEMENT MODE |
Maximum operating temperature | 175 °C |
Package body material | PLASTIC/EPOXY |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Polarity/channel type | N-CHANNEL |
Maximum power dissipation(Abs) | 111 W |
Maximum pulsed drain current (IDM) | 240 A |
Certification status | Not Qualified |
surface mount | YES |
Terminal surface | Matte Tin (Sn) |
Terminal form | GULL WING |
Terminal location | SINGLE |
Maximum time at peak reflow temperature | NOT SPECIFIED |
transistor applications | SWITCHING |
Transistor component materials | SILICON |
Base Number Matches | 1 |
PHD63NQ03LT | PHB63NQ03LT | |
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Description | TRANSISTOR 68.9 A, 30 V, 0.0177 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252, PLASTIC, SC-63, DPAK-3, FET General Purpose Power | 68.9A, 30V, 0.0177ohm, N-CHANNEL, Si, POWER, MOSFET, PLASTIC, D2PAK-3 |
Maker | NXP | NXP |
package instruction | PLASTIC, SC-63, DPAK-3 | PLASTIC, D2PAK-3 |
Contacts | 3 | 3 |
Reach Compliance Code | not_compliant | compliant |
ECCN code | EAR99 | EAR99 |
Is Samacsys | N | N |
Shell connection | DRAIN | DRAIN |
Configuration | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage | 30 V | 30 V |
Maximum drain current (Abs) (ID) | 68.9 A | 68.9 A |
Maximum drain current (ID) | 68.9 A | 68.9 A |
Maximum drain-source on-resistance | 0.0177 Ω | 0.0177 Ω |
FET technology | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
JESD-30 code | R-PSSO-G2 | R-PSSO-G2 |
Number of components | 1 | 1 |
Number of terminals | 2 | 2 |
Operating mode | ENHANCEMENT MODE | ENHANCEMENT MODE |
Maximum operating temperature | 175 °C | 175 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE |
Polarity/channel type | N-CHANNEL | N-CHANNEL |
Maximum power dissipation(Abs) | 111 W | 111 W |
Maximum pulsed drain current (IDM) | 240 A | 240 A |
Certification status | Not Qualified | Not Qualified |
surface mount | YES | YES |
Terminal form | GULL WING | GULL WING |
Terminal location | SINGLE | SINGLE |
transistor applications | SWITCHING | SWITCHING |
Transistor component materials | SILICON | SILICON |
Base Number Matches | 1 | 1 |