LPC1767FBD100 datasheet, PDF - EEWORLD Datasheet

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LPC1767FBD100: Description512kB Flash, 64kB SRAM, Ethernet, no CAN, LQFP100 package; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，93 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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LPC1767FBD100 Overview

512kB Flash, 64kB SRAM, Ethernet, no CAN, LQFP100 package

LPC1767FBD100 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	QFP
package instruction	LFQFP,
Contacts	100
Reach Compliance Code	compliant
Has ADC	YES
Address bus width
bit size	32
maximum clock frequency	25 MHz
DAC channel	YES
DMA channel	YES
External data bus width
JESD-30 code	S-PQFP-G100
length	14 mm
Humidity sensitivity level	3
Number of I/O lines	70
Number of terminals	100
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
ROM programmability	FLASH
Maximum seat height	1.6 mm
speed	100 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	2.4 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Pure Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

LPC1767FBD100 Related Products

	LPC1767FBD100	LPC1763FBD100	LPC1764FBD100	LPC1765FBD100	LPC1765FET100	LPC1766FBD100	LPC1768FBD100	LPC1768FET100
Description	512kB Flash, 64kB SRAM, Ethernet, no CAN, LQFP100 package	256kB Flash, 64kB SRAM, no CAN, LQFP100 package	128kB Flash, 32kB SRAM, Ethernet, USB, LQFP100 package	256kB Flash, 64kB SRAM, USB, LQFP100 package	32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA100, 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100	256kB Flash, 64kB SRAM, Ethernet, USB, LQFP100 package	512kB Flash, 64kB SRAM, Ethernet, USB, LQFP100 package	512kB Flash, 64kB SRAM, Ethernet, USB, TFBGA100 package
Is it Rohs certified?	conform to	conform to	conform to	conform to	-	conform to	conform to	conform to
Maker	NXP	NXP	-	NXP	-	NXP	-	NXP
Parts packaging code	QFP	QFP	QFP	QFP	-	QFP	QFP	BGA
package instruction	LFQFP,	LFQFP,	LQFP-100	LFQFP, QFP100,.63SQ,20	-	LFQFP, QFP100,.63SQ,20	LFQFP, QFP100,.63SQ,20	TFBGA,
Contacts	100	100	100	100	-	100	100	100
Reach Compliance Code	compliant	compliant	compliant	compliant	-	compliant	compliant	compliant
Has ADC	YES	YES	YES	YES	-	YES	YES	YES
bit size	32	32	32	32	-	32	32	32
maximum clock frequency	25 MHz	25 MHz	25 MHz	25 MHz	-	25 MHz	25 MHz	25 MHz
DAC channel	YES	YES	YES	YES	-	YES	YES	YES
DMA channel	YES	YES	YES	YES	-	YES	YES	YES
JESD-30 code	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	-	S-PQFP-G100	S-PQFP-G100	S-PBGA-B100
length	14 mm	14 mm	14 mm	14 mm	-	14 mm	14 mm	9 mm
Humidity sensitivity level	3	3	3	3	-	3	3	3
Number of I/O lines	70	70	70	70	-	70	70	70
Number of terminals	100	100	100	100	-	100	100	100
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	-	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	-	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	LFQFP	LFQFP	LFQFP	-	LFQFP	LFQFP	TFBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	-	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	-	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260	-	260	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
ROM programmability	FLASH	FLASH	FLASH	FLASH	-	FLASH	FLASH	FLASH
Maximum seat height	1.6 mm	1.6 mm	1.6 mm	1.6 mm	-	1.6 mm	1.6 mm	1.2 mm
speed	100 MHz	100 MHz	100 MHz	100 MHz	-	100 MHz	100 MHz	100 MHz
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	-	3.6 V	3.6 V	3.6 V
Minimum supply voltage	2.4 V	2.4 V	2.4 V	2.4 V	-	2.4 V	2.4 V	2.4 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	-	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Pure Tin (Sn)	Pure Tin (Sn)	Tin (Sn)	Tin (Sn)	-	Tin (Sn)	Tin (Sn)	-
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	-	GULL WING	GULL WING	BALL
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	-	0.5 mm	0.5 mm	0.8 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	-	QUAD	QUAD	BOTTOM
Maximum time at peak reflow temperature	30	30	30	30	-	30	30	30
width	14 mm	14 mm	14 mm	14 mm	-	14 mm	14 mm	9 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	-	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC

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