PIC10F200/202/204/206
PIC10F200/202/204/206 Rev. A Silicon/Data Sheet Errata
The PIC10F200/202/204/206 parts you have received
conform functionally to the Device Data Sheet
(DS41239D), except for the anomalies described
below.
Microchip intends to address all issues listed here in
future revisions of the
PIC10F200/202/204/206
silicon.
Where noted, issues apply to listed revision
only.
3. Module: I
PD
, Power-Down Base current
On the PIC10F200/202/204/206 silicon, revisions
earlier than A3, the power-down base current may
remain higher than the specification for a short
time when entering Sleep.
The following graph illustrates the device current
upon entering Sleep:
1. Module: Port Pins
On the PIC10F204/206 silicon, Rev. A0, the data
direction control latch for port pin GP2 is overrid-
den when the comparator output is used internally.
This applies when the following bit configuration is
used:
T0CS =
1
CMPT0CS =
0
COUTEN =
1
Work around
This issue is fixed in Rev. A1 and later.
OPTION<5>
CMCON0<4>
CMCON0<6>
FIGURE 1:
I
DD
I
PD
Time
Device enters
Sleep
Device current
reaches I
PD
2. Module: Comparator
On the PIC10F204/206 silicon, Rev. A0, the inter-
nal voltage reference is disabled when a
SLEEP
instruction is executed.
Work around
Do not issue a
SLEEP
instruction when using the
internal 0.6V voltage reference. This issue is fixed
in Rev. A1 and later.
The length of time between the device entering
Sleep mode and the device current reaching I
PD
increases as both temperature and voltage
decrease.
Work around
This issue is fixed in Rev. A3 and later.
©
2007 Microchip Technology Inc.
DS80194G-page 1
PIC10F200/202/204/206
APPENDIX A:
REVISION HISTORY
Rev A Document (6/2004)
First revision of this document.
Rev B Document (6/2004)
Added Module 2, V
REF
is disabled in Sleep.
Rev C Document (9/2004)
Added Module 3, MPLAB IDE and the _CONFIG
assembly directive.
Rev D Document (6/2006)
Added the following Modules to the “Clarifications/
Corrections to the Data Sheet” section:
Module 1,
“
Internal Oscillator”
Module 2, “Voltage Reference”
Module 3, “8-Lead 2x3 DFN (MC) Packaging”
Module 4, “8-Lead 2x3 DFN (MC) Package – Top
Marking”
• Module 5, “6-Lead SOT-23 (OT) Package – Top
Marking”
•
•
•
•
Rev E Document (3/2007)
Revised Module 1 and Module 2 work arounds.
Clarification/Corrections to the Data Sheet:
Revised Module 3: Replaced DFN Package Drawing;
Added Module 6, “Timer0 Clock”;
Added Module 7, Special Features of the CPU,
Register 9-1.
Rev F Document (5/2007)
Revised Module 3, Table 1, Note 1.
Clarification/Corrections to the Data Sheet:
Data Sheet was updated. The following was removed:
Module 1,
“
Internal Oscillator”
Module 2, “Voltage Reference”
Module 3, “8-Lead 2x3 DFN (MC) Packaging”
Module 4, “8-Lead 2x3 DFN (MC) Package – Top
Marking”
• Module 5, “6-Lead SOT-23 (OT) Package – Top
Marking”
• Module 6, “Timer0 Clock”;
•
•
•
•
Module 7, Special Features of the CPU, Register 9-1 is
renumbered to Module 1.
Rev G Document (6/2007)
Moved Module 3 to Module 4.
Added Module 3: I
PD
, Power-Down Base current
DS80194G-page 4
©
2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
•
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
•
•
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
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dsPIC, K
EE
L
OQ
, K
EE
L
OQ
logo, microID, MPLAB, PIC,
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© 2007, Microchip Technology Incorporated, Printed in the
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Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
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and India. The Company’s quality system processes and procedures
are for its PIC
®
MCUs and dsPIC
®
DSCs, K
EE
L
OQ
®
code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
©
2007 Microchip Technology Inc.
DS80194G-page 5
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