IBM0165805BJ3C-60 datasheet, PDF

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IBM0165805BJ3C-60: DescriptionEDO DRAM, 8MX8, 60ns, CMOS, PDSO32, 0.400 X 0.825 INCH, PLASTIC, SOJ-32; Categorystorage; File Size354KB，32 Pages; ManufacturerIBM; Websitehttp://www.ibm.com

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IBM0165805BJ3C-60 Overview

EDO DRAM, 8MX8, 60ns, CMOS, PDSO32, 0.400 X 0.825 INCH, PLASTIC, SOJ-32

IBM0165805BJ3C-60 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IBM
Parts packaging code	SOJ
package instruction	SOJ, SOJ32,.44
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Is Samacsys	N
access mode	FAST PAGE WITH EDO
Maximum access time	60 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type	COMMON
JESD-30 code	R-PDSO-J32
JESD-609 code	e0
length	20.95 mm
memory density	67108864 bit
Memory IC Type	EDO DRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	32
word count	8388608 words
character code	8000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8MX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	SOJ
Encapsulate equivalent code	SOJ32,.44
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	8192
Maximum seat height	3.76 mm
self refresh	NO
Maximum standby current	0.001 A
Maximum slew rate	0.115 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.16 mm
Base Number Matches	1

IBM0165805BJ3C-60 Related Products

	IBM0165805BJ3C-60	PTN2512H2104BBT3	IBM0165805BJ3C-50	IBM0165805BT3C-50	IBM0165805PT3C-50	PTN2512H2104BSTF
Description	EDO DRAM, 8MX8, 60ns, CMOS, PDSO32, 0.400 X 0.825 INCH, PLASTIC, SOJ-32	Fixed Resistor, Thin Film, 2W, 2100000ohm, 200V, 0.1% +/-Tol, 50ppm/Cel, Surface Mount, 2512, CHIP	EDO DRAM, 8MX8, 50ns, CMOS, PDSO32, 0.400 X 0.825 INCH, PLASTIC, SOJ-32	EDO DRAM, 8MX8, 50ns, CMOS, PDSO32, 0.400 X 0.825 INCH, PLASTIC, TSOP2-32	EDO DRAM, 8MX8, 50ns, CMOS, PDSO32, 0.400 X 0.825 INCH, PLASTIC, TSOP2-32	RESISTOR, THIN FILM, 1 W, 0.1 %, 50 ppm, 2100000 ohm, SURFACE MOUNT, 2512, CHIP, ROHS COMPLIANT
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	conform to
package instruction	SOJ, SOJ32,.44	CHIP	SOJ, SOJ32,.44	TSOP2, TSOP32,.46	TSOP2, TSOP32,.46	SMT, 2512
Reach Compliance Code	unknown	not_compliant	unknown	unknown	unknown	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	ANTI-SULFUR; LASER TRIMMABLE; NON-INDUCTIVE	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH	ANTI-SULFUR; LASER TRIMMABLE; NON-INDUCTIVE
Number of terminals	32	2	32	32	32	2
Maximum operating temperature	70 °C	155 °C	70 °C	70 °C	70 °C	155 °C
Package form	SMALL OUTLINE	SMT	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMT
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	THIN FILM	CMOS	CMOS	CMOS	THIN FILM
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Matte Tin (Sn) - with Nickel (Ni) barrier
Is it lead-free?	Contains lead	-	Contains lead	Contains lead	Contains lead	Lead free
Maker	IBM	-	IBM	IBM	IBM	-
Parts packaging code	SOJ	-	SOJ	TSOP2	TSOP2	-
Contacts	32	-	32	32	32	-
Is Samacsys	N	-	N	N	N	-
access mode	FAST PAGE WITH EDO	-	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	-
Maximum access time	60 ns	-	50 ns	50 ns	50 ns	-
I/O type	COMMON	-	COMMON	COMMON	COMMON	-
JESD-30 code	R-PDSO-J32	-	R-PDSO-J32	R-PDSO-G32	R-PDSO-G32	-
JESD-609 code	e0	-	e0	e0	e0	-
length	20.95 mm	-	20.95 mm	20.95 mm	20.95 mm	-
memory density	67108864 bit	-	67108864 bit	67108864 bit	67108864 bit	-
Memory IC Type	EDO DRAM	-	EDO DRAM	EDO DRAM	EDO DRAM	-
memory width	8	-	8	8	8	-
Number of functions	1	-	1	1	1	-
Number of ports	1	-	1	1	1	-
word count	8388608 words	-	8388608 words	8388608 words	8388608 words	-
character code	8000000	-	8000000	8000000	8000000	-
Operating mode	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-
organize	8MX8	-	8MX8	8MX8	8MX8	-
Output characteristics	3-STATE	-	3-STATE	3-STATE	3-STATE	-
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	SOJ	-	SOJ	TSOP2	TSOP2	-
Encapsulate equivalent code	SOJ32,.44	-	SOJ32,.44	TSOP32,.46	TSOP32,.46	-
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
power supply	3.3 V	-	3.3 V	3.3 V	3.3 V	-
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	-
refresh cycle	8192	-	8192	8192	8192	-
Maximum seat height	3.76 mm	-	3.76 mm	1.2 mm	1.2 mm	-
self refresh	NO	-	NO	NO	YES	-
Maximum standby current	0.001 A	-	0.001 A	0.001 A	0.0002 A	-
Maximum slew rate	0.115 mA	-	0.14 mA	0.14 mA	0.14 mA	-
Maximum supply voltage (Vsup)	3.6 V	-	3.6 V	3.6 V	3.6 V	-
Minimum supply voltage (Vsup)	3 V	-	3 V	3 V	3 V	-
Nominal supply voltage (Vsup)	3.3 V	-	3.3 V	3.3 V	3.3 V	-
Temperature level	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	-
Terminal form	J BEND	-	J BEND	GULL WING	GULL WING	-
Terminal pitch	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm	-
Terminal location	DUAL	-	DUAL	DUAL	DUAL	-
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
width	10.16 mm	-	10.16 mm	10.16 mm	10.16 mm	-
Base Number Matches	1	-	1	1	1	-

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