DDR DRAM, 32MX16, 7.5ns, CMOS, PBGA60, 8 X 9 MM, GREEN, PLASTIC, VFBGA-60
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Micron Technology |
Parts packaging code | BGA |
package instruction | VFBGA, |
Contacts | 60 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Is Samacsys | N |
access mode | FOUR BANK PAGE BURST |
Maximum access time | 7.5 ns |
Other features | AUTO/SELF REFRESH |
JESD-30 code | R-PBGA-B60 |
JESD-609 code | e1 |
length | 9 mm |
memory density | 536870912 bit |
Memory IC Type | DDR DRAM |
memory width | 16 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 60 |
word count | 33554432 words |
character code | 32000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 1 mm |
self refresh | YES |
Maximum supply voltage (Vsup) | 1.95 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 8 mm |
Base Number Matches | 1 |
MT46HC32M16LFBF-75:B | MT46HC16M32LFCX-5IT:B | MT46HC32M16LFBF-54IT:B | MT46HC16M32LFCM-6L:B | MT46HC16M32LGCX-6L:B | MT46HC32M16LFCX-75LIT:B | MT46HC32M16LGCM-6IT:B | MT46HC32M16LFCM-5LIT:B | MT46HC32M16LFBF-5IT:B | |
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Description | DDR DRAM, 32MX16, 7.5ns, CMOS, PBGA60, 8 X 9 MM, GREEN, PLASTIC, VFBGA-60 | DDR DRAM, 16MX32, 5ns, CMOS, PBGA90, 9 X 13 MM, GREEN, PLASTIC, VFBGA-90 | DDR DRAM, 32MX16, 5.4ns, CMOS, PBGA60, 8 X 9 MM, GREEN, PLASTIC, VFBGA-60 | DDR DRAM, 16MX32, 6ns, CMOS, PBGA90, 10 X 13 MM, GREEN, PLASTIC, VFBGA-90 | DDR DRAM, 16MX32, 6ns, CMOS, PBGA90, 9 X 13 MM, GREEN, PLASTIC, VFBGA-90 | DDR DRAM, 32MX16, 7.5ns, CMOS, PBGA90, 9 X 13 MM, GREEN, PLASTIC, VFBGA-90 | DDR DRAM, 32MX16, 6ns, CMOS, PBGA90, 10 X 13 MM, GREEN, PLASTIC, VFBGA-90 | DDR DRAM, 32MX16, 5ns, CMOS, PBGA90, 10 X 13 MM, GREEN, PLASTIC, VFBGA-90 | DDR DRAM, 32MX16, 5ns, CMOS, PBGA60, 8 X 9 MM, GREEN, PLASTIC, VFBGA-60 |
Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
Maker | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
Parts packaging code | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
package instruction | VFBGA, | VFBGA, | VFBGA, | VFBGA, | VFBGA, | VFBGA, | VFBGA, | VFBGA, | VFBGA, |
Contacts | 60 | 90 | 60 | 90 | 90 | 90 | 90 | 90 | 60 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Is Samacsys | N | N | N | N | N | N | N | N | N |
access mode | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
Maximum access time | 7.5 ns | 5 ns | 5.4 ns | 6 ns | 6 ns | 7.5 ns | 6 ns | 5 ns | 5 ns |
Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 code | R-PBGA-B60 | R-PBGA-B90 | R-PBGA-B60 | R-PBGA-B90 | R-PBGA-B90 | R-PBGA-B90 | R-PBGA-B90 | R-PBGA-B90 | R-PBGA-B60 |
JESD-609 code | e1 | e1 | e1 | e1 | e1 | e1 | e1 | e1 | e1 |
length | 9 mm | 13 mm | 9 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 9 mm |
memory density | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit |
Memory IC Type | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM |
memory width | 16 | 32 | 16 | 32 | 32 | 16 | 16 | 16 | 16 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 60 | 90 | 60 | 90 | 90 | 90 | 90 | 90 | 60 |
word count | 33554432 words | 16777216 words | 33554432 words | 16777216 words | 16777216 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words |
character code | 32000000 | 16000000 | 32000000 | 16000000 | 16000000 | 32000000 | 32000000 | 32000000 | 32000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | - | -40 °C | -40 °C | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
organize | 32MX16 | 16MX32 | 32MX16 | 16MX32 | 16MX32 | 32MX16 | 32MX16 | 32MX16 | 32MX16 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
self refresh | YES | YES | YES | YES | YES | YES | YES | YES | YES |
Maximum supply voltage (Vsup) | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V |
Minimum supply voltage (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
width | 8 mm | 9 mm | 8 mm | 10 mm | 9 mm | 10 mm | 10 mm | 10 mm | 8 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |