GS832236E-225M datasheet, PDF - EEWORLD Datasheet

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GS832236E-225M: DescriptionCache SRAM, 1MX36, 7ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FPBGA-165; Categorystorage; File Size679KB，39 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/

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GS832236E-225M Overview

Cache SRAM, 1MX36, 7ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FPBGA-165

GS832236E-225M Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	GSI Technology
Parts packaging code	BGA
package instruction	LBGA, BGA165,11X15,40
Contacts	165
Reach Compliance Code	unknown
ECCN code	3A991.B.2.B
Factory Lead Time	8 weeks
Is Samacsys	N
Maximum access time	7 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY
Maximum clock frequency (fCLK)	225 MHz
I/O type	COMMON
JESD-30 code	R-PBGA-B165
length	17 mm
memory density	37748736 bit
Memory IC Type	CACHE SRAM
memory width	36
Number of functions	1
Number of terminals	165
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	1MX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA165,11X15,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
power supply	2.5/3.3 V
Certification status	Not Qualified
Maximum seat height	1.5 mm
Maximum standby current	0.2 A
Minimum standby current	2.3 V
Maximum slew rate	0.36 mA
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	15 mm
Base Number Matches	1

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Description	Cache SRAM, 1MX36, 7ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FPBGA-165	Cache SRAM, 512KX72, 7ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209	Cache SRAM, 512KX72, 7ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209	Cache SRAM, 1MX36, 7ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FPBGA-165	Cache SRAM, 1MX36, 7ns, CMOS, PBGA119, 22 X 14 MM, 1.27 MM PITCH, FPBGA-119	Cache SRAM, 1MX36, 7ns, CMOS, PBGA119, 22 X 14 MM, 1.27 MM PITCH, FPBGA-119	Cache SRAM, 2MX18, 7ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FPBGA-165	Cache SRAM, 2MX18, 7ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FPBGA-165	Cache SRAM, 2MX18, 7ns, CMOS, PBGA119, 22 X 14 MM, 1.27 MM PITCH, FPBGA-119	Cache SRAM, 2MX18, 7ns, CMOS, PBGA119, 22 X 14 MM, 1.27 MM PITCH, FPBGA-119
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	LBGA, BGA165,11X15,40	LBGA, BGA209,11X19,40	LBGA, BGA209,11X19,40	LBGA, BGA165,11X15,40	BGA, BGA119,7X17,50	BGA, BGA119,7X17,50	LBGA, BGA165,11X15,40	LBGA, BGA165,11X15,40	BGA, BGA119,7X17,50	BGA, BGA119,7X17,50
Contacts	165	209	209	165	119	119	165	165	119	119
Reach Compliance Code	unknown	compliant	compliant	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B
Maximum access time	7 ns	7 ns	7 ns	7 ns	7 ns	7 ns	7 ns	7 ns	7 ns	7 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY
Maximum clock frequency (fCLK)	225 MHz	225 MHz	225 MHz	225 MHz	225 MHz	225 MHz	225 MHz	225 MHz	225 MHz	225 MHz
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PBGA-B165	R-PBGA-B209	R-PBGA-B209	R-PBGA-B165	R-PBGA-B119	R-PBGA-B119	R-PBGA-B165	R-PBGA-B165	R-PBGA-B119	R-PBGA-B119
length	17 mm	22 mm	22 mm	17 mm	22 mm	22 mm	17 mm	17 mm	22 mm	22 mm
memory density	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit
Memory IC Type	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM
memory width	36	72	72	36	36	36	18	18	18	18
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	165	209	209	165	119	119	165	165	119	119
word count	1048576 words	524288 words	524288 words	1048576 words	1048576 words	1048576 words	2097152 words	2097152 words	2097152 words	2097152 words
character code	1000000	512000	512000	1000000	1000000	1000000	2000000	2000000	2000000	2000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	1MX36	512KX72	512KX72	1MX36	1MX36	1MX36	2MX18	2MX18	2MX18	2MX18
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LBGA	LBGA	LBGA	LBGA	BGA	BGA	LBGA	LBGA	BGA	BGA
Encapsulate equivalent code	BGA165,11X15,40	BGA209,11X19,40	BGA209,11X19,40	BGA165,11X15,40	BGA119,7X17,50	BGA119,7X17,50	BGA165,11X15,40	BGA165,11X15,40	BGA119,7X17,50	BGA119,7X17,50
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY	GRID ARRAY	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.5 mm	1.7 mm	1.7 mm	1.5 mm	1.99 mm	1.99 mm	1.5 mm	1.5 mm	1.99 mm	1.99 mm
Maximum standby current	0.2 A	0.2 A	0.2 A	0.2 A	0.2 A	0.2 A	0.2 A	0.2 A	0.2 A	0.2 A
Minimum standby current	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V
Maximum slew rate	0.36 mA	0.39 mA	0.39 mA	0.36 mA	0.36 mA	0.36 mA	0.28 mA	0.28 mA	0.28 mA	0.28 mA
Maximum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Minimum supply voltage (Vsup)	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1.27 mm	1.27 mm	1 mm	1 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	15 mm	14 mm	14 mm	15 mm	14 mm	14 mm	15 mm	15 mm	14 mm	14 mm
Maker	GSI Technology	GSI Technology	GSI Technology	GSI Technology	-	-	GSI Technology	GSI Technology	GSI Technology	GSI Technology
Base Number Matches	1	1	1	1	1	1	-	-	-	-

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