|
SN74LVC126APWR |
SN74LVC126ADRG4 |
Description |
Logic circuit family: 74LVC Logic type: buffer, non-inverting number of components: 4 Number of bits per component: 1 |
Logic circuit family: 74LVC Logic type: buffer, non-inverting number of components: 4 Number of bits per component: 1 |
Brand Name |
Texas Instruments |
Texas Instruments |
Is it lead-free? |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
Parts packaging code |
TSSOP |
SOIC |
package instruction |
TSSOP, TSSOP14,.25 |
SOP, SOP14,.25 |
Contacts |
14 |
14 |
Reach Compliance Code |
compliant |
compliant |
Control type |
ENABLE HIGH |
ENABLE HIGH |
Counting direction |
UNIDIRECTIONAL |
UNIDIRECTIONAL |
series |
LVC/LCX/Z |
LVC/LCX/Z |
JESD-30 code |
R-PDSO-G14 |
R-PDSO-G14 |
JESD-609 code |
e4 |
e4 |
length |
5 mm |
8.65 mm |
Load capacitance (CL) |
50 pF |
50 pF |
Logic integrated circuit type |
BUS DRIVER |
BUS DRIVER |
MaximumI(ol) |
0.024 A |
0.024 A |
Humidity sensitivity level |
1 |
1 |
Number of digits |
1 |
1 |
Number of functions |
4 |
4 |
Number of ports |
2 |
2 |
Number of terminals |
14 |
14 |
Maximum operating temperature |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
Output characteristics |
3-STATE |
3-STATE |
Output polarity |
TRUE |
TRUE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
SOP |
Encapsulate equivalent code |
TSSOP14,.25 |
SOP14,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
method of packing |
TR |
TR |
Peak Reflow Temperature (Celsius) |
260 |
260 |
power supply |
3.3 V |
3.3 V |
Maximum supply current (ICC) |
0.04 mA |
0.04 mA |
Prop。Delay @ Nom-Sup |
6 ns |
6 ns |
propagation delay (tpd) |
11.3 ns |
11.3 ns |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
1.2 mm |
1.75 mm |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
1.65 V |
1.65 V |
Nominal supply voltage (Vsup) |
1.8 V |
1.8 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
GULL WING |
GULL WING |
Terminal pitch |
0.65 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
width |
4.4 mm |
3.9 mm |