Reference Spec.No.JENF243A-0024K-01
Reference Only
P1/9
GHz Noise Suppression Chip Ferrite Bead
BLM15H□□□□SN1□ Reference Specification
1.Scope
This reference specification applies to Chip Ferrite Bead BLM15H_SN series.
2.Part Numbering
(ex.)
BL
M
15
HG
601
S
N
1
D
(1)
(2)
(3)
(4)
(5)
(6) (7) (8)
(9)
(1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz
(6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk)
Impedance (Ω)
(Under Standard
Rated
Testing Condition) Current
(mA)
at 100MHz
at 1GHz
600±25%
1000±25%
600±25%
1000±25%
1800±25%
120±25%
220±25%
1000±40%
1400±40%
1400±40%
2000±40%
2700±40%
500±40%
900±40%
300
250
300
250
200
300
250
DC Resistance
(Ω max.)
Initial
Values
Values After
Testing
0.7 max
1.1 max
3.Rating
Customer
Part Number
MURATA
Part Number
BLM15HG601SN1D
BLM15HG601SN1B
BLM15HG102SN1D
BLM15HG102SN1B
BLM15HD601SN1D
BLM15HD601SN1B
BLM15HD102SN1D
BLM15HD102SN1B
BLM15HD182SN1D
BLM15HD182SN1B
BLM15HB121SN1D
BLM15HB121SN1B
BLM15HB221SN1D
BLM15HB221SN1B
Remark
0.8 max For
general
1.2 max use
0.85 max 0.95 max
1.25 max 1.35 max
2.2 max
0.7 max
1.0 max
For
2.3 max High speed
Signal line
0.8 max
1.1 max
■Operating
Temperature : -55°C to +125°C
4
.Style and Dimensions
1.0±0.05
0.5±0.05
0.5±0.05
■Storage
Temperature : -55°C to +125°C
■
Equivalent Circuit
0.25±0.1
(
: Electrode
(in mm)
Resistance element becomes
dominant at high frequencies.
)
■
Unit Mass (Typical value)
0.001g
5.Marking
No marking.
6.Standard Testing Conditions
<
Unless otherwise specified
>
Temperature : Ordinary Temp. (15 °C to 35 °C )
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
<
In case of doubt
>
Temperature : 20°C±2 °C
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
MURATA MFG.CO.,LTD.
Reference Spec.No.JENF243A-0024K-01
7.Specifications
7-1.Electrical Performance
No.
Item
7-1-1 Impedance
Reference Only
P2/9
Specification
Meet item 3.
7-1-2 DC Resistance
Test Method
Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz
Measuring Equipment :
KEYSIGHT4291A
or the equivalent
Test Fixture :
KEYSIGHT16192A
or the equivalent
Measuring Equipment : Digital multi meter
*Except resistance of the Substrate and Wire
7-2.Mechanical Performance
No.
Item
7-2-1 Appearance and
Dimensions
7-2-2 Bonding
Strength
Specification
Meet item 4.
Meet Table 1.
Table 1
Appearance
Impedance
Change
(at 100MHz)
DC
Resistance
No damage
Within ±30%
Meet item 3.
Substrate
Test Method
Visual Inspection and measured with Slide Calipers.
It shall be soldered on the substrate.
Applying Force(F) : 5N
Applying Time : 5s±1s
Applying Direction: Parallel to the substrate.
Ｆ
R0.5
Side view
Ｆ
7-2-3 Bending
Strength
It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm×40mm×0.8mm
Deflection : 2.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
Pressure jig
F
Deflection
45mm
45mm
R340
Product
7-2-4
Vibration
7-2-5 Resistance
to Soldering
Heat
7-2-6 Drop
Products shall be no failure
after tested.
It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 2000Hz to 10Hz
for 20 min
Total Amplitude 1.5mm or Acceleration 196m/s
2
whichever is smaller
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
Pre-Heating : 150°C±10°C, 60s½90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition
for 48h±4h.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 75cm
Attitude from which the product is dropped : 3 direction
The number of times : 3 times for each direction
(Total 9 times)
MURATA MFG.CO.,LTD.
Reference Spec.No.JENF243A-0024K-01
No.
Item
7½2-7 Solderability
Reference Only
Test Method
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s½90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
P3/9
Specification
The electrodes shall be at
least 95% covered with new
solder coating.
7-3.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
7-3-1 Temperature Meet Table 1.
Cycle
Test Method
1 cycle:
1 step:-55
°C(+0 °C,-3 °C)
/ 30min±3min
2 step:Ordinary temp. / 3min max.
3 step:+125
°C(+3 °C,-0 °C)
/ 30min±3min
4 step: Ordinary temp. / 3min max.
Total of 100 cycles
Then measured after exposure in the room condition for 48h±4h.
Temperature : 70°C±2°C
Humidity : 90%RH to 95%RH
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : 125°C±3°C
Applying Current : Rated Current (at Test temperature)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : -55±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
7-3-2 Humidity
7-3-3 Heat Life
7-3-4 Cold
Resistance
8. Specification of Packaging
8-1.Appearance and Dimensions
(8mm-wide paper tape)
2.0±0.05
2.0±0.05 4.0±0.1
φ
1.5
-0
+0.1
1.15(Typ.)
3.5±0.05
1.75±0.1
8.0±0.3
0.65(Typ.)
0.8max.
Direction of Feed
(in mm)
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole:Sprocket hole shall be located on the right hand side toward the direction of feed.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
MURATA MFG.CO.,LTD.
Reference Spec.No.JENF243A-0024K-01
8-2.Tape Strength
(1)Pull Strength
Top tape
5N min.
Bottom tape
(2)Peeling off force of Cover tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
Reference Only
P4/9
165 to 180 degree
Top tape
F
Bottom tape
Base tape
8-3.Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel
10000 pcs. / reel
(2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity, etc)
∗1)
« Expression of Inspection No. »
(1)
Factory Code
(2)
Date
□□
(1)
OOOO
×××
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O,N,D
Third, Fourth digit : Day
ROHS – Y (△)
(1) (2)
(3)
Serial No.
∗2)
« Expression of RoHS marking »
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked on
a label and the label is stuck on the box.
(Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking(∗2) , Quantity , etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
Trailer
2.0±0.5
160 min.
Leader
Label
190 min.
Empty tape
φ
13.0±0.2
210 min.
Top tape
1
φ
60±
0
9±
1
0
13±1.4
φ
180±
3
0
φ
21.0±0.8
Direction of feed
(in mm)
MURATA MFG.CO.,LTD.
Reference Spec.No.JENF243A-0024K-01
Reference Only
P5/9
8-4. Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
5
∗
Above Outer Case size is typical. It depends on a quantity of an order.
Label
H
D
W
9.
！
Caution
9-1. Surge current
Excessive surge current ( pulse current or rush current) than specified rated current applied to the product may cause
a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-2.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment
(6)Disaster prevention / crime prevention equipment
(2)Aerospace equipment
(7)Traffic signal equipment
(3)Undersea equipment
(8)Transportation equipment (vehicles, trains, ships, etc.)
(4)Power plant control equipment
(9)Applications of similar complexity and /or reliability requirements
(5)Medical equipment
to the applications listed in the above
10. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1.Land pattern designing
•
Standard land dimensions (Reflow soldering)
Chip Ferrite Bead
0.5
0.4
1.2½1.4
Solder Resist
Pattern
(in mm)
10-2.Soldering Conditions
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100
µm
to 200
μm
MURATA MFG.CO.,LTD.
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