Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Microchip |
Parts packaging code | DFN |
package instruction | HVSON, SOLCC8,.25 |
Contacts | 8 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Factory Lead Time | 7 weeks |
high side driver | NO |
Interface integrated circuit type | PUSH-PULL BASED MOSFET DRIVER |
JESD-30 code | R-PDSO-N8 |
JESD-609 code | e3 |
length | 5.99 mm |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 8 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -40 °C |
Nominal output peak current | 4 A |
Package body material | PLASTIC/EPOXY |
encapsulated code | HVSON |
Encapsulate equivalent code | SOLCC8,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 4.5/18 V |
Certification status | Not Qualified |
Maximum seat height | 1 mm |
Maximum supply voltage | 18 V |
Minimum supply voltage | 4.5 V |
Nominal supply voltage | 12 V |
surface mount | YES |
technology | CMOS |
Temperature level | AUTOMOTIVE |
Terminal surface | Matte Tin (Sn) |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |
Disconnect time | 0.07 µs |
connection time | 0.07 µs |
width | 4.9 mm |