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SPA11N60CFD

Description
Drain-source voltage (Vdss): 600V Continuous drain current (Id) (at 25°C): 11A (Tc) Gate-source threshold voltage: 5V @ 1.9mA Drain-source on-resistance: 440mΩ @ 7A, 10V Maximum power consumption Dispersion (Ta=25°C): 33W (Tc) Type: N channel N channel, 600V, 11A, 0.44Ω@10V
CategoryDiscrete semiconductor    The transistor   
File Size554KB,12 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
Environmental Compliance
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SPA11N60CFD Overview

Drain-source voltage (Vdss): 600V Continuous drain current (Id) (at 25°C): 11A (Tc) Gate-source threshold voltage: 5V @ 1.9mA Drain-source on-resistance: 440mΩ @ 7A, 10V Maximum power consumption Dispersion (Ta=25°C): 33W (Tc) Type: N channel N channel, 600V, 11A, 0.44Ω@10V

SPA11N60CFD Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerInfineon
Parts packaging codeTO-220AB
package instructionFLANGE MOUNT, R-PSFM-T3
Contacts3
Reach Compliance Codecompliant
Other featuresAVALANCHE RATED
Avalanche Energy Efficiency Rating (Eas)340 mJ
Shell connectionISOLATED
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage600 V
Maximum drain current (Abs) (ID)11 A
Maximum drain current (ID)11 A
Maximum drain-source on-resistance0.44 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JEDEC-95 codeTO-220AB
JESD-30 codeR-PSFM-T3
Number of components1
Number of terminals3
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)33 W
Maximum pulsed drain current (IDM)28 A
Certification statusNot Qualified
surface mountNO
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
Transistor component materialsSILICON
SPA11N60CFD
CoolMOS
TM
Power Transistor
Features
• New revolutionary high voltage technology
• Intrinsic fast-recovery body diode
• Extremely low reverse recovery charge
• Ultra low gate charge
Product Summary
V
DS
R
DS(on),max
I
D1)
600
0.44
11
V
"
A
PG-TO220-3-31
• Extreme dv /dt rated
• High peak current capability
• Periodic avalanche rated
• Qualified for industrial grade applications according to JEDEC
0)
Type
SPA11N60CFD
Package
TO-220-3-31
Ordering Code
SP000216317
Marking
11N60CFD
Maximum ratings,
at
T
j
=25 °C, unless otherwise specified
Parameter
Continuous drain current
1)
Symbol Conditions
I
D
T
C
=25 °C
T
C
=100 °C
Pulsed drain current
2)
Avalanche energy, single pulse
Avalanche energy, repetitive
2),3)
Avalanche current, repetitive
2),3)
Drain source voltage slope
Reverse diode dv /dt
Maximum diode commutation speed
Gate source voltage
I
D,pulse
E
AS
E
AR
I
AR
dv /dt
dv /dt
di /dt
V
GS
I
D
=11 A,
V
DS
=480 V,
T
j
=125 °C
I
S
=11 A,
V
DS
=480 V,
T
j
=125 °C
static
AC (f >1 Hz)
Power dissipation
Operating and storage temperature
P
tot
T
j
,
T
stg
T
C
=25 °C
T
C
=25 °C
I
D
=5.5 A,
V
DD
=50 V
I
D
=11 A,
V
DD
=50 V
Value
11
7
28
340
0.6
11
80
40
600
±20
±30
33
-55 ... 150
W
°C
A
V/ns
V/ns
A/µs
V
mJ
Unit
A
Rev. 1.4
page 1
2010-12-21

SPA11N60CFD Related Products

SPA11N60CFD SPA11N60CFDXKSA1
Description Drain-source voltage (Vdss): 600V Continuous drain current (Id) (at 25°C): 11A (Tc) Gate-source threshold voltage: 5V @ 1.9mA Drain-source on-resistance: 440mΩ @ 7A, 10V Maximum power consumption Dispersion (Ta=25°C): 33W (Tc) Type: N channel N channel, 600V, 11A, 0.44Ω@10V MOSFET N-CH 600V 11A TO220-3
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Maker Infineon Infineon
Parts packaging code TO-220AB TO-220AB
package instruction FLANGE MOUNT, R-PSFM-T3 FLANGE MOUNT, R-PSFM-T3
Contacts 3 3
Reach Compliance Code compliant compliant
Other features AVALANCHE RATED AVALANCHE RATED
Avalanche Energy Efficiency Rating (Eas) 340 mJ 340 mJ
Shell connection ISOLATED ISOLATED
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage 600 V 600 V
Maximum drain current (ID) 11 A 11 A
Maximum drain-source on-resistance 0.44 Ω 0.44 Ω
FET technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95 code TO-220AB TO-220AB
JESD-30 code R-PSFM-T3 R-PSFM-T3
Number of components 1 1
Number of terminals 3 3
Operating mode ENHANCEMENT MODE ENHANCEMENT MODE
Maximum operating temperature 150 °C 150 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR
Package form FLANGE MOUNT FLANGE MOUNT
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
Polarity/channel type N-CHANNEL N-CHANNEL
Maximum pulsed drain current (IDM) 28 A 28 A
Certification status Not Qualified Not Qualified
surface mount NO NO
Terminal form THROUGH-HOLE THROUGH-HOLE
Terminal location SINGLE SINGLE
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
Transistor component materials SILICON SILICON

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