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MIS-114-01-L-D-K

Description
Board-to-Board and Mezzanine Connectors.025" Mixed Technology Socket
CategoryThe connector    Surface plate and sandwich connector   
File Size670KB,2 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
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MIS-114-01-L-D-K Overview

Board-to-Board and Mezzanine Connectors.025" Mixed Technology Socket

MIS-114-01-L-D-K Parametric

Parameter NameAttribute value
MakerSAMTEC
Product CategoryBoard-to-Board and Mezzanine Connectors
Shipping restrictionsMouser does not currently sell this product.
productSockets
Number of locations228 Position
Pitch0.635 mm
Number of rows2 Row
Termination typeSMD/SMT
Installation angleStraight
Voltage rating275 VAC
seriesMIS
EncapsulationTray
Contact platingGold
Shell materialLiquid Crystal Polymer (LCP)
Contact materialPhosphor Bronze
Flammability ratingUL 94 V-0
Installation styleSMD
Maximum operating temperature+ 125 C
Minimum operating temperature- 55 C
stacking height5 mm
Factory packaging quantity24
F-219 SUPPLEMENT
MIS–019–01–F–D
®
MIS–057–01–L–D
MIS–038–01–F–D
(0.635 mm) .025"
MIS SERIES
MIXED TECHNOLOGY SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MIS
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
275 VAC
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
MIT
Standoffs:
SO
Integral metal plane
for power or ground
Polarized
• Mixed
technology
footprint
HIGH-SPEED CHANNEL PERFORMANCE
MIT/MIS @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (019-057)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
28
G b p s
76 signal lines
per linear inch
MIS
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
D
OTHER
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
–019, –038, –057
(38 total positions per bank)
= Gold Flash on Signal Pins and
Ground Plane, Matte Tin on tails
–F
–L
= (7.00 mm)
.275" DIA
Polyimide
film Pick &
Place Pad
–K
ALSO AVAILABLE
(MOQ Required)
• 11 mm, 16 mm, 18.75 mm
and 22 mm stack height
• 30 µ" (0.76 µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
• 76, 95, 114 and 133
positions per row
= 10 µ" (0.25 µm)
Gold on Signal Pins and
Ground Plane, Matte Tin on tails
= Tape &
Reel
–TR
(No. of Positions/19) x (12.70) .500 + (12.70) .500
(12.70) .500
(6.22)
.245
(0.635)
.025
(1.32)
.052
(0.69) .027
(0.15)
.006
01
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over
150 µ" (3.81 µm) Ni on
Signal Pins in contact area,
10 µ" (0.25 µm) min Au over
50 µ" (1.27 µm) Ni on Ground
Plane in contact area, Matte Tin
over 50 µ" (1.27 µm) min Ni
on all solder tails
*Note:
–C Plating passes 10 year MFG testing
–C*
02
MATED HEIGHT*
(3.43)
.135
(7.49)
.295
(3.63)
.143
(0.18)
.007
MIS
LEAD
STYLE
MIT LEAD
STYLE
–01
–02
–01
(5.00) (8.00)
.197 .315
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
Note:
Rugged through-hole ground plane soldered to board
(requires paste-over-hole, not press-fit) for added retention to PCB.
Due to technical progress, all designs, specifications and components are subject to change without notice.
*Processing conditions
will affect mated height.
See SO Series for board
space tolerances.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM

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