HDAF-15-08.0-S-13-2-P datasheet, PDF

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HDAF-15-08.0-S-13-2-P: DescriptionBoard-to-Board and Mezzanine Connectors2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Socket; CategoryThe connector The connector; File Size691KB，2 Pages; ManufacturerSAMTEC; Websitehttp://www.samtec.com/; Environmental Compliance

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HDAF-15-08.0-S-13-2-P Overview

Board-to-Board and Mezzanine Connectors2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Socket

HDAF-15-08.0-S-13-2-P Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SAMTEC
package instruction	ROHS COMPLIANT
Reach Compliance Code	compliant
Factory Lead Time	2 weeks
Board mount options	PEG
body width	0.886 inch
subject depth	0.414 inch
body length	1.887 inch
Body/casing type	SOCKET
Connector type	BOARD STACKING CONNECTOR
Contact to complete cooperation	GOLD (30) OVER NICKEL (50)
Contact completed and terminated	Matte Tin (Sn) - with Nickel (Ni) barrier
Contact point gender	FEMALE
Contact material	COPPER ALLOY
contact mode	RECTANGULAR
Contact resistance	15 mΩ
DIN compliance	NO
Dielectric withstand voltage	700VAC V
Durability	100 Cycles
Filter function	NO
IEC compliance	NO
Insulation resistance	5000000000 Ω
Insulator color	BLACK
insulator material	LIQUID CRYSTAL POLYMER (LCP)
JESD-609 code	e3
MIL compliance	NO
Plug contact pitch	0.079 inch
Plug information	MULTIPLE MATING PARTS AVAILABLE
Mixed contacts	NO
Installation option 1	LOCKING
Installation method	STRAIGHT
Installation type	BOARD
Number of connectors	ONE
PCB row number	13
Number of rows loaded	13
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Options	GENERAL PURPOSE
PCB contact pattern	RECTANGULAR
PCB contact row spacing	1.1938 mm
Plating thickness	30u inch
Rated current (signal)	1.8 A
Guideline	UL
reliability	COMMERCIAL
Terminal pitch	2 mm
Termination type	SURFACE MOUNT
Total number of contacts	195

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F-219 SUPPLEMENT

HDAF–23–08.0–S–13–2

(2.00 mm) .0787"

HDAF–15–18.0–S–13–2

HDAF SERIES

RUGGED ELEVATED HIGH-DENSITY ARRAY

SPECIFICATIONS

For complete specifications and

recommended PCB layouts see

www.samtec.com?HDAF

Insulator Material:

Black LCP

Contact Material:

Copper Alloy

Plating:

Au or Sn over

50 µ" (1.27 µm) Ni

Current Rating:

3.4 A per pin

(6 adjacent pins powered)

Operating Temp Range:

-55 °C to +125 °C

Working Voltage:

200 VAC

Mated Cycles:

100

RoHS Compliant:

Yes

Lead-Free Solderable:

Yes

Mates with:

HDAM

Intermateable with

Molex HD Mezz

Open-pin-field for

Single-Ended

or Differential Pair

configurations

299,

195

and

143

pins

Lead-Free

Solder

Charge

• Integrated guide

posts

Elevated

stack

heights

of 20 mm,

25 mm,

30 mm

and 35 mm

RECOGNITIONS

For complete scope of

recognitions see

www.samtec.com/quality

FILE NO. E111594

HDAF

NO. OF PINS

PER ROW

LEAD

STYLE

PLATING

OPTION

NO. OF

ROWS

SOLDER

TYPE

OTHER

OPTION

DIFFERENTIAL

APPLICATIONS

(1.20)

.0472

–11, –15, –23

Specify

LEAD

STYLE

from

chart

= 30 µ"

(0.76 µm)

Gold on

contact area,

Matte Tin

on tails and

guide pins

–S

–13

(2.00)

.0787

= Lead-Free

Tin Alloy

95.5% Sn/

3.8% Ag/

0.7% Cu

Solder

Charge

–2

= Pick &

Place Pad

–P

(22.50)

.886

ARRAY

11x13

15x13

23x13

*2:1 S:G Ratio

PAIR

COUNT*

No.

Pins

Per

Row

(2.00)

.0787

(11.55)

.455

ALSO AVAILABLE

(MOQ Required)

• Tin-Lead Solder Charge

• Other platings

(2.00)

.0787

No.

Pins

Per

Row

(2.00)

.0787

(17.92)

.706

LEAD

STYLE

(10.51)

.414

(20.51)

.807

–08.0

–18.0

Notes:

HD Mezz is a trademark of

Molex Incorporated

Note:

Some lengths, styles

and options are non-standard,

non-returnable.

(1.20)

.0472

Due to technical progress, all designs, specifications and components are subject to change without notice.

All parts within this catalog are built to Samtec’s specifications.

Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.

WWW.SAMTEC.COM

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