S25FL128P0XNFI013 datasheet, PDF

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S25FL128P0XNFI013: Description16M X 8 FLASH 3V PROM, DSO8; Categorystorage storage; File Size2MB，48 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S25FL128P0XNFI013 Overview

16M X 8 FLASH 3V PROM, DSO8

S25FL128P0XNFI013 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	SON
package instruction	6 X 8 MM, LEAD FREE, PLASTIC, WSON-8
Contacts	8
Reach Compliance Code	unknow
ECCN code	3A991.B.1.A
Maximum clock frequency (fCLK)	104 MHz
Data retention time - minimum	20
Durability	100000 Write/Erase Cycles
JESD-30 code	R-XDSO-N8
JESD-609 code	e3
length	8 mm
memory density	134217728 bi
Memory IC Type	FLASH
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of terminals	8
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	16MX8
Package body material	UNSPECIFIED
encapsulated code	VSON
Encapsulate equivalent code	SOLCC8,.3
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	0.85 mm
Serial bus type	SPI
Maximum standby current	0.00002 A
Maximum slew rate	0.026 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
type	NOR TYPE
width	6 mm
write protect	HARDWARE/SOFTWARE

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S25FL128P

128 Megabit CMOS 3.0 Volt Flash Memory

with 104-MHz SPI (Serial Peripheral Interface) Bus

Data Sheet

(Preliminary)

S25FL128P Cover Sheet

Notice to Readers:

This document states the current technical specifications regarding the Spansion

product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume

such that subsequent versions of this document are not expected to change. However, typographical or

specification corrections, or modifications to the valid combinations offered may occur.

Publication Number

S25FL128P_00

Revision

Issue Date

July 2, 2007

Data

Sheet

(Pre limin ar y)

Notice On Data Sheet Designations

Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of

product information or intended specifications throughout the product life cycle, including development,

qualification, initial production, and full production. In all cases, however, readers are encouraged to verify

that they have the latest information before finalizing their design. The following descriptions of Spansion data

sheet designations are presented here to highlight their presence and definitions.

Advance Information

The Advance Information designation indicates that Spansion Inc. is developing one or more specific

products, but has not committed any design to production. Information presented in a document with this

designation is likely to change, and in some cases, development on the product may discontinue. Spansion

Inc. therefore places the following conditions upon Advance Information content:

“This document contains information on one or more products under development at Spansion Inc.

The information is intended to help you evaluate this product. Do not design in this product without

contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed

product without notice.”

Preliminary

The Preliminary designation indicates that the product development has progressed such that a commitment

to production has taken place. This designation covers several aspects of the product life cycle, including

product qualification, initial production, and the subsequent phases in the manufacturing process that occur

before full production is achieved. Changes to the technical specifications presented in a Preliminary

document should be expected while keeping these aspects of production under consideration. Spansion

places the following conditions upon Preliminary content:

“This document states the current technical specifications regarding the Spansion product(s)

described herein. The Preliminary status of this document indicates that product qualification has been

completed, and that initial production has begun. Due to the phases of the manufacturing process that

require maintaining efficiency and quality, this document may be revised by subsequent versions or

modifications due to changes in technical specifications.”

Combination

Some data sheets contain a combination of products with different designations (Advance Information,

Preliminary, or Full Production). This type of document distinguishes these products and their designations

wherever necessary, typically on the first page, the ordering information page, and pages with the DC

Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first

page refers the reader to the notice on this page.

Full Production (No Designation on Document)

When a product has been in production for a period of time such that no changes or only nominal changes

are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include

those affecting the number of ordering part numbers available, such as the addition or deletion of a speed

option, temperature range, package type, or V

range. Changes may also include those needed to clarify a

description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following

conditions to documents in this category:

“This document states the current technical specifications regarding the Spansion product(s)

described herein. Spansion Inc. deems the products to have been in sufficient production volume such

that subsequent versions of this document are not expected to change. However, typographical or

specification corrections, or modifications to the valid combinations offered may occur.”

Questions regarding these document designations may be directed to your local sales office.

S25FL128P

S25FL128P_00_04 July 2, 2007

Data

Sheet

(Pre limin ar y)

Table of Contents

Distinctive Characteristics

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

General Description

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Block Diagram

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Connection Diagrams

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Input/Output Descriptions

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Logic Symbol

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Ordering Information

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

5.1

Valid Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Spansion SPI Modes

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Device Operations

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.1

Byte or Page Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.2

Sector Erase / Bulk Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.3

Monitoring Write Operations Using the Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.4

Active Power and Standby Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.5

Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.6

Data Protection Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.7

Hold Mode (HOLD#) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.

11.

Sector Address Table.

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Parallel Mode (for 16-pin SO package only).

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Accelerated Programming Operation.

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Command Definitions

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.1 Read Data Bytes (READ: 03h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.2 Read Data Bytes at Higher Speed (FAST_READ: 0Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.3 Read Identification (RDID: 9Fh). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.4 Read Manufacturer and Device ID (READ_ID: 90h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.5 Write Enable (WREN: 06h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.6 Write Disable (WRDI: 04h). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.7 Read Status Register (RDSR: 05h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.8 Write Status Register (WRSR: 01h). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.9 Page Program (PP: 02h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.10 Sector Erase (SE: 20h, D8h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.11 Bulk Erase (BE: C7h, 60h). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.12 Deep Power Down (DP: B9h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.13 Release from Deep Power Down (RES: ABh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.14 Release from Deep Power Down and Read Electronic Signature (RES: ABh) . . . . . . . . . . .

11.15 Command Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

12.

13.

14.

15.

16.

17.

18.

19.

20.

Program Acceleration via WP#/ACC pin

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Power-up and Power-down

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Initial Delivery State

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Absolute Maximum Ratings

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Operating Ranges

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

DC Characteristics

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Test Conditions

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

AC Characteristics

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Physical Dimensions

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

20.1 SO3 016 wide—16-pin Plastic Small Outline Package (300-mil Body Width) . . . . . . . . . . . . 45

20.2 WSON 8-contact (6 x 8 mm) No-Lead Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Revision History

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

21.

S25FL128P

S25FL128P_00_04 July 2, 2007

Da ta

Shee t

(Prelimi nar y)

Figures

Figure 2.1

Figure 2.2

Figure 6.1

Figure 6.2

Figure 7.1

Figure 11.1

Figure 11.2

Figure 11.3

Figure 11.4

Figure 11.5

Figure 11.6

Figure 11.7

Figure 11.8

Figure 11.9

Figure 11.10

Figure 11.11

Figure 11.12

Figure 11.13

Figure 11.14

Figure 11.15

Figure 11.16

Figure 11.17

Figure 11.18

Figure 11.19

Figure 11.20

16-pin Plastic Small Outline Package (SO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

8-Pin WSON Package (6 x 8 mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Bus Master and Memory Devices on the SPI Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

SPI Modes Supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Hold Mode Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Read Data Bytes (READ) Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Parallel Read Instruction Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Read Data Bytes at Higher Speed (FAST_READ) Command Sequence . . . . . . . . . . . . . . . 21

Read Identification Command Sequence and Data Out Sequence. . . . . . . . . . . . . . . . . . . . 22

Parallel Read_ID Command Sequence and Data Out Sequence . . . . . . . . . . . . . . . . . . . . . 23

Serial READ_ID Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Parallel Read_ID Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Write Enable (WREN) Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Write Disable (WRDI) Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Read Status Register (RDSR) Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Parallel Read Status Register (RDSR) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . .28

Write Status Register (WRSR) Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Parallel Write Status Register (WRSR) Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . 29

Page Program (PP) Command Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Parallel Page Program (PP) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Sector Erase (SE) Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Bulk Erase (BE) Command Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Deep Power Down (DP) Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Release from Deep Power Down (RES) Command Sequence . . . . . . . . . . . . . . . . . . . . . . . 36

Serial Release from Deep Power Down and

Read Electronic Signature (RES) Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

Figure 11.21 Parallel Release from Deep Power Down and

Read Electronic Signature (RES) Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

Figure 12.1 ACC Program Acceleration Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38

Figure 13.1 Power-Up Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Figure 15.1 Maximum Negative Overshoot Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Figure 15.2 Maximum Positive Overshoot Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Figure 18.1 AC Measurements I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Figure 19.1 SPI Mode 0 (0,0) Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Figure 19.2 SPI Mode 0 (0,0) Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Figure 19.3 HOLD# Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Figure 19.4 Write Protect Setup and Hold Timing during WRSR when SRWD=1 . . . . . . . . . . . . . . . . . . 44

July 2, 2007 S25FL128P_00_04

S25FL128P

S25FL128P0XNFI013 Related Products

	S25FL128P0XNFI013	S25FL128P	S25FL128P0XMFI011	S25FL128P0XMFI001	S25FL128P0XNFI001	S25FL128P0XNFI003	S25FL128P0XNFI011	S25FL128P0XMFI003	S25FL128P0XMFI013
Description	16M X 8 FLASH 3V PROM, DSO8	16M X 8 FLASH 3V PROM, PDSO16	16M X 8 FLASH 3V PROM, PDSO16	16M X 8 FLASH 3V PROM, PDSO16	16M X 8 FLASH 3V PROM, DSO8	16M X 8 FLASH 3V PROM, DSO8	16M X 8 FLASH 3V PROM, PDSO16	16M X 8 FLASH 3V PROM, PDSO16	16M X 8 FLASH 3V PROM, PDSO16
memory width	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	8	16	16	16	8	8	8	16	16
Maximum operating temperature	85 °C	85 Cel	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 Cel	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	16MX8	16M × 8	16MX8	16MX8	16MX8	16MX8	16MX8	16MX8	16MX8
surface mount	YES	Yes	YES	YES	YES	YES	YES	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	GULL WING	GULL WING	GULL WING	NO LEAD	NO LEAD	NO LEAD	GULL WING	GULL WING
Terminal location	DUAL	pair	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Is it lead-free?	Lead free	-	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	-	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	SPANSION	-	SPANSION	SPANSION	SPANSION	SPANSION	SPANSION	SPANSION	SPANSION
Parts packaging code	SON	-	SOIC	SOIC	SON	SON	SON	SOIC	SOIC
package instruction	6 X 8 MM, LEAD FREE, PLASTIC, WSON-8	-	0.300 INCH, LEAD FREE, PLASTIC, MS-013AA, SOP-16	0.300 INCH, LEAD FREE, PLASTIC, MS-013AA, SOP-16	6 X 8 MM, LEAD FREE, PLASTIC, WSON-8	6 X 8 MM, LEAD FREE, PLASTIC, WSON-8	6 X 8 MM, LEAD FREE, PLASTIC, WSON-8	0.300 INCH, LEAD FREE, PLASTIC, MS-013AA, SOP-16	0.300 INCH, LEAD FREE, PLASTIC, MS-013AA, SOP-16
Contacts	8	-	16	16	8	8	8	16	16
Reach Compliance Code	unknow	-	unknow	unknow	unknow	unknow	unknow	unknow	unknow
ECCN code	3A991.B.1.A	-	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
Maximum clock frequency (fCLK)	104 MHz	-	104 MHz	104 MHz	104 MHz	104 MHz	104 MHz	104 MHz	104 MHz
Data retention time - minimum	20	-	20	20	20	20	20	20	20
Durability	100000 Write/Erase Cycles	-	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles
JESD-30 code	R-XDSO-N8	-	R-PDSO-G16	R-PDSO-G16	R-XDSO-N8	R-XDSO-N8	R-XDSO-N8	R-PDSO-G16	R-PDSO-G16
JESD-609 code	e3	-	e3	e3	e3	e3	e3	e3	e3
length	8 mm	-	10.3 mm	10.3 mm	8 mm	8 mm	8 mm	10.3 mm	10.3 mm
memory density	134217728 bi	-	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi
Memory IC Type	FLASH	-	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Humidity sensitivity level	3	-	3	3	3	3	3	3	3
word count	16777216 words	-	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words
character code	16000000	-	16000000	16000000	16000000	16000000	16000000	16000000	16000000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Package body material	UNSPECIFIED	-	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VSON	-	SOP	SOP	VSON	VSON	VSON	SOP	SOP
Encapsulate equivalent code	SOLCC8,.3	-	SOP16,.4	SOP16,.4	SOLCC8,.3	SOLCC8,.3	SOLCC8,.3	SOP16,.4	SOP16,.4
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE	-	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	SERIAL	-	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	260	-	260	260	260	260	260	260	260
power supply	3/3.3 V	-	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
Programming voltage	3 V	-	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	0.85 mm	-	2.65 mm	2.65 mm	0.85 mm	0.85 mm	0.85 mm	2.65 mm	2.65 mm
Serial bus type	SPI	-	SPI	SPI	SPI	SPI	SPI	SPI	SPI
Maximum standby current	0.00002 A	-	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A
Maximum slew rate	0.026 mA	-	0.026 mA	0.026 mA	0.026 mA	0.026 mA	0.026 mA	0.026 mA	0.026 mA
Maximum supply voltage (Vsup)	3.6 V	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	-	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	-	3 V	3 V	3 V	3 V	3 V	3 V	3 V
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal surface	Matte Tin (Sn)	-	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
Terminal pitch	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Maximum time at peak reflow temperature	40	-	40	40	40	40	40	40	40
type	NOR TYPE	-	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	6 mm	-	7.5 mm	7.5 mm	6 mm	6 mm	6 mm	7.5 mm	7.5 mm
write protect	HARDWARE/SOFTWARE	-	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE

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Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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