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S71WS128JA0BAWAY0

Description
Stacked Multi-Chip Product (MCP)
Categorystorage    storage   
File Size2MB,186 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
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S71WS128JA0BAWAY0 Overview

Stacked Multi-Chip Product (MCP)

S71WS128JA0BAWAY0 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSPANSION
Parts packaging codeBGA
package instructionTFBGA,
Contacts84
Reach Compliance Codecompli
JESD-30 codeR-PBGA-B84
JESD-609 codee0
length11.6 mm
memory density134217728 bi
Memory IC TypeMEMORY CIRCUIT
memory width16
Number of functions1
Number of terminals84
word count8388608 words
character code8000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize8MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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