Stacked Multi-Chip Product (MCP)
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | SPANSION |
Parts packaging code | BGA |
package instruction | TFBGA, |
Contacts | 84 |
Reach Compliance Code | compli |
JESD-30 code | R-PBGA-B84 |
JESD-609 code | e0 |
length | 11.6 mm |
memory density | 134217728 bi |
Memory IC Type | MEMORY CIRCUIT |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 84 |
word count | 8388608 words |
character code | 8000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -25 °C |
organize | 8MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum supply voltage (Vsup) | 1.95 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 8 mm |