AT25128AW-10SU-1.8 datasheet, PDF

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AT25128AW-10SU-1.8: DescriptionElectrically erasable programmable read-only memory 10MS 8 EIAJ IND TEMP 1.8V; Categorystorage storage; File Size414KB，24 Pages; ManufacturerAtmel (Microchip); Environmental Compliance

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AT25128AW-10SU-1.8 Overview

Electrically erasable programmable read-only memory 10MS 8 EIAJ IND TEMP 1.8V

AT25128AW-10SU-1.8 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Atmel (Microchip)
Parts packaging code	SOIC
package instruction	0.209 INCH, GREEN, EIAJ, PLASTIC, SOIC-8
Contacts	8
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum clock frequency (fCLK)	5 MHz
Data retention time - minimum	100
Durability	100000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8
JESD-609 code	e3
length	5.29 mm
memory density	131072 bit
Memory IC Type	EEPROM
memory width	8
Humidity sensitivity level	1
Number of functions	1
Number of terminals	8
word count	16384 words
character code	16000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	16KX8
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.3
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
power supply	2/5 V
Certification status	Not Qualified
Maximum seat height	2.16 mm
Serial bus type	SPI
Maximum standby current	0.000003 A
Maximum slew rate	0.01 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	2.7 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn) - annealed
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	5.24 mm
Maximum write cycle time (tWC)	5 ms
write protect	HARDWARE/SOFTWARE
Base Number Matches	1

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Features

•

Serial Peripheral Interface (SPI) Compatible

Supports SPI Modes 0 (0,0) and 3 (1,1)

Data Sheet Describes Mode 0 Operation

Low-voltage and Standard-voltage Operation

– 2.7 (V

= 2.7V to 5.5V)

– 1.8 (V

= 1.8V to 5.5V)

20 MHz Clock Rate (5V)

64-byte Page Mode and Byte Write Operation

Block Write Protection

– Protect 1/4, 1/2, or Entire Array

Write Protect (WP) Pin and Write Disable Instructions for

Both Hardware and Software Data Protection

Self-timed Write Cycle (5 ms Max)

High-reliability

– Endurance: 1 Million Write Cycles

– Data Retention: >100 Years

8-lead PDIP, 8-lead EIAJ SOIC, 8-lead JEDEC SOIC, 8-lead TSSOP, 8-ball dBGA2 and 8-

lead Ultra Thin SAP Packages

Lead-free/Halogen-free

Available in Automotive

Die Sales: Wafer Form, Waffle Pack, and Bumped Die

•

SPI Serial

EEPROMs

128K (16,384 x 8)

256K (32,768 x 8)

•

AT25128A

AT25256A

Not

Recommended

for New Design

Description

The AT25128A/256A provides 131,072/262,144 bits of serial electrically-erasable pro-

grammable read only memory (EEPROM) organized as 16,384/32,768 words of 8 bits

each. The device is optimized for use in many industrial and commercial applications

where low-power and low-voltage operation are essential. The devices are available

in space saving 8-lead PDIP, 8-lead EIAJ SOIC, 8-lead JEDEC SOIC, 8-lead TSSOP,

8-ball dBGA2 and 8-lead SAP packages. In addition, the entire family is available in

2.7V (2.7V to 5.5V) and 1.8V (1.8V to 5.5V) versions.

The AT25128A/256A is enabled through the Chip Select pin (CS) and accessed via a

3-wire interface consisting of Serial Data Input (SI), Serial Data Output (SO), and

Serial Clock (SCK). All programming cycles are completely self-timed, and no sepa-

rate Erase cycle is required before Write.

8-lead PDIP

GND

VCC

HOLD

SCK

GND

8-lead SOIC

VCC

HOLD

SCK

GND

8-lead TSSOP

VCC

HOLD

SCK

8-lead Ultra Thin SAP

VCC

HOLD

SCK

GND

8-ball dBGA2

VCC

HOLD

SCK

GND

3368J–SEEPR–06/07

Bottom View

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Is it Rohs certified?	conform to	-	-	-	-	conform to	conform to	conform to	conform to
Maker	Atmel (Microchip)	-	-	-	-	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)
Parts packaging code	SOIC	-	-	-	-	SOIC	TSSOP	DIP	SOIC
package instruction	0.209 INCH, GREEN, EIAJ, PLASTIC, SOIC-8	-	-	-	-	0.209 INCH, GREEN, EIAJ, PLASTIC, SOIC-8	4.40 MM, GREEN, PLASTIC, MO-153AA, TSSOP-8	0.300 INCH, GREEN, PLASTIC, MS-001BA, DIP-8	0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8
Contacts	8	-	-	-	-	8	8	8	8
Reach Compliance Code	unknown	-	-	-	-	unknown	unknown	unknown	unknown
ECCN code	EAR99	-	-	-	-	EAR99	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	5 MHz	-	-	-	-	10 MHz	10 MHz	5 MHz	10 MHz
Data retention time - minimum	100	-	-	-	-	100	100	100	100
Durability	100000 Write/Erase Cycles	-	-	-	-	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8	-	-	-	-	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8	R-PDSO-G8
JESD-609 code	e3	-	-	-	-	e3	e3	e3	e3
length	5.29 mm	-	-	-	-	5.29 mm	4.4 mm	9.271 mm	4.9 mm
memory density	131072 bit	-	-	-	-	131072 bit	131072 bit	131072 bit	131072 bit
Memory IC Type	EEPROM	-	-	-	-	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	-	-	-	-	8	8	8	8
Humidity sensitivity level	1	-	-	-	-	1	1	1	1
Number of functions	1	-	-	-	-	1	1	1	1
Number of terminals	8	-	-	-	-	8	8	8	8
word count	16384 words	-	-	-	-	16384 words	16384 words	16384 words	16384 words
character code	16000	-	-	-	-	16000	16000	16000	16000
Operating mode	SYNCHRONOUS	-	-	-	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	-	-	-	-	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-	-	-	-	-40 °C	-40 °C	-40 °C	-40 °C
organize	16KX8	-	-	-	-	16KX8	16KX8	16KX8	16KX8
Package body material	PLASTIC/EPOXY	-	-	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	-	-	-	-	SOP	TSSOP	DIP	SOP
Encapsulate equivalent code	SOP8,.3	-	-	-	-	SOP8,.3	TSSOP8,.25	DIP8,.3	SOP8,.25
Package shape	RECTANGULAR	-	-	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	-	-	-	-	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE	SMALL OUTLINE
Parallel/Serial	SERIAL	-	-	-	-	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	260	-	-	-	-	260	260	NOT SPECIFIED	260
power supply	2/5 V	-	-	-	-	3/5 V	3/5 V	2/5 V	3/5 V
Certification status	Not Qualified	-	-	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.16 mm	-	-	-	-	2.16 mm	1.2 mm	5.334 mm	1.75 mm
Serial bus type	SPI	-	-	-	-	SPI	SPI	SPI	SPI
Maximum standby current	0.000003 A	-	-	-	-	0.000003 A	0.000003 A	0.000003 A	0.000003 A
Maximum slew rate	0.01 mA	-	-	-	-	0.01 mA	0.01 mA	0.01 mA	0.01 mA
Maximum supply voltage (Vsup)	5.5 V	-	-	-	-	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.8 V	-	-	-	-	2.7 V	2.7 V	1.8 V	2.7 V
Nominal supply voltage (Vsup)	2.7 V	-	-	-	-	5 V	5 V	2.7 V	5 V
surface mount	YES	-	-	-	-	YES	YES	NO	YES
technology	CMOS	-	-	-	-	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	-	-	-	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Matte Tin (Sn) - annealed	-	-	-	-	Matte Tin (Sn) - annealed	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
Terminal form	GULL WING	-	-	-	-	GULL WING	GULL WING	THROUGH-HOLE	GULL WING
Terminal pitch	1.27 mm	-	-	-	-	1.27 mm	0.65 mm	2.54 mm	1.27 mm
Terminal location	DUAL	-	-	-	-	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	40	-	-	-	-	40	40	NOT SPECIFIED	40
width	5.24 mm	-	-	-	-	5.24 mm	3 mm	7.62 mm	3.9 mm
Maximum write cycle time (tWC)	5 ms	-	-	-	-	5 ms	5 ms	5 ms	5 ms
write protect	HARDWARE/SOFTWARE	-	-	-	-	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE

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