S71WS512NC0BAWAP2 datasheet, PDF

S71WS512NC0BAWAP2: DescriptionStacked Multi-Chip Product (MCP); Categorystorage storage; File Size175KB，13 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S71WS512NC0BAWAP2 Overview

Stacked Multi-Chip Product (MCP)

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	TFBGA, BGA84,10X12,32
Contacts	84
Reach Compliance Code	compli
Is Samacsys	N
Maximum access time	80 ns
Other features	PSRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE
JESD-30 code	R-PBGA-B84
JESD-609 code	e1
length	11.6 mm
memory density	536870912 bi
Memory IC Type	MEMORY CIRCUIT
memory width	16
Mixed memory types	FLASH+PSRAM
Humidity sensitivity level	3
Number of functions	1
Number of terminals	84
word count	33554432 words
character code	32000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	32MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA84,10X12,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	1.8 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.00007 A
Maximum slew rate	0.054 mA
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	8 mm
Base Number Matches	1

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