Static random access memory 2.5 or 3.3V 2M x 18 36M
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | GSI Technology |
| Parts packaging code | BGA |
| package instruction | LBGA, BGA165,11X15,40 |
| Contacts | 165 |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.2.B |
| Factory Lead Time | 8 weeks |
| Maximum access time | 5.5 ns |
| Other features | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE |
| Maximum clock frequency (fCLK) | 250 MHz |
| I/O type | COMMON |
| JESD-30 code | R-PBGA-B165 |
| JESD-609 code | e1 |
| length | 15 mm |
| memory density | 37748736 bit |
| Memory IC Type | CACHE SRAM |
| memory width | 18 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 165 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 2MX18 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LBGA |
| Encapsulate equivalent code | BGA165,11X15,40 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, LOW PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 2.5/3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.4 mm |
| Maximum standby current | 0.04 A |
| Minimum standby current | 2.3 V |
| Maximum slew rate | 0.23 mA |
| Maximum supply voltage (Vsup) | 2.7 V |
| Minimum supply voltage (Vsup) | 2.3 V |
| Nominal supply voltage (Vsup) | 2.5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN SILVER COPPER |
| Terminal form | BALL |
| Terminal pitch | 1 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 13 mm |
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