32-bit microcontroller - MCU 256KB Flash 64KB RAM USB 2xCAN 8 DMA
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Microchip |
Parts packaging code | BGA |
package instruction | 10 X 10 MM, 1.10 MM HEIGHT, LEAD FREE, PLASTIC, XBGA-121 |
Contacts | 121 |
Reach Compliance Code | compliant |
ECCN code | 3A991.A.2 |
Factory Lead Time | 11 weeks |
Has ADC | YES |
Address bus width | |
bit size | 32 |
CPU series | PIC |
maximum clock frequency | 50 MHz |
DAC channel | NO |
DMA channel | YES |
External data bus width | |
JESD-30 code | S-PBGA-B121 |
JESD-609 code | e1 |
length | 10 mm |
Number of I/O lines | 83 |
Number of terminals | 121 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
PWM channel | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Encapsulate equivalent code | BGA121,11X11,32 |
Package shape | SQUARE |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 2.5/3.3 V |
Certification status | Not Qualified |
RAM (bytes) | 65536 |
rom(word) | 262144 |
ROM programmability | FLASH |
Maximum seat height | 1.2 mm |
speed | 80 MHz |
Maximum slew rate | 98 mA |
Maximum supply voltage | 3.6 V |
Minimum supply voltage | 2.3 V |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 10 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER, RISC |