Single-Ended Multiplexer, 3 Func, 2 Channel, CMOS, CDIP16,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | RCA |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
Is Samacsys | N |
Analog Integrated Circuits - Other Types | SINGLE-ENDED MULTIPLEXER |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
Number of channels | 2 |
Number of functions | 3 |
Number of terminals | 16 |
Maximum on-state resistance (Ron) | 270 Ω |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5,GND/-5 V |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Maximum signal current | 0.025 A |
Maximum supply current (Isup) | 0.32 mA |
surface mount | NO |
Maximum connection time | 48 ns |
switch | BREAK-BEFORE-MAKE |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
CD54HCT4053F/3A | CD54HC4053F/3A | CD74HC4053E | |
---|---|---|---|
Description | Single-Ended Multiplexer, 3 Func, 2 Channel, CMOS, CDIP16, | Single-Ended Multiplexer, 3 Func, 2 Channel, CMOS, CDIP16 | Single-Ended Multiplexer, 3 Func, 2 Channel, CMOS, PDIP16, |
Is it Rohs certified? | incompatible | incompatible | incompatible |
package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown |
Analog Integrated Circuits - Other Types | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
JESD-30 code | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 |
JESD-609 code | e0 | e0 | e0 |
Number of channels | 2 | 2 | 2 |
Number of functions | 3 | 3 | 3 |
Number of terminals | 16 | 16 | 16 |
Maximum on-state resistance (Ron) | 270 Ω | 270 Ω | 225 Ω |
Maximum operating temperature | 125 °C | 125 °C | 85 °C |
Minimum operating temperature | -55 °C | -55 °C | -40 °C |
Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE |
power supply | 5,GND/-5 V | 2/6,GND/-6 V | 2/6,GND/-6 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum signal current | 0.025 A | 0.025 A | 0.025 A |
surface mount | NO | NO | NO |
Maximum connection time | 48 ns | 220 ns | 220 ns |
switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
technology | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 |
Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - |