AM29DS324GB120WMI datasheet, PDF

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AM29DS324GB120WMI: DescriptionIC,EEPROM,NOR FLASH,2MX16/4MX8,CMOS,BGA,48PIN,PLASTIC; Categorystorage; File Size1MB，52 Pages; ManufacturerCypress Semiconductor

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AM29DS324GB120WMI Overview

IC,EEPROM,NOR FLASH,2MX16/4MX8,CMOS,BGA,48PIN,PLASTIC

AM29DS324GB120WMI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Reach Compliance Code	compliant
Is Samacsys	N
Maximum access time	120 ns
Spare memory width	8
startup block	BOTTOM
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B48
memory density	33554432 bit
Memory IC Type	FLASH
Number of departments/size	8,63
Number of terminals	48
word count	2097152 words
character code	2000000
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA48,6X8,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, FINE PITCH
Parallel/Serial	PARALLEL
power supply	1.8/2.2 V
Certification status	Not Qualified
ready/busy	YES
Department size	8K,64K
Maximum standby current	0.000005 A
Maximum slew rate	0.025 mA
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
switch bit	YES
type	NOR TYPE
Base Number Matches	1

AM29DS324GB120WMI Related Products

	AM29DS324GB120WMI	AM29DS324GB120EIN	AM29DS324GB120EEN	AM29DS324GB70WMIN
Description	IC,EEPROM,NOR FLASH,2MX16/4MX8,CMOS,BGA,48PIN,PLASTIC	IC,EEPROM,NOR FLASH,2MX16/4MX8,CMOS,TSSOP,48PIN,PLASTIC	IC,EEPROM,NOR FLASH,2MX16/4MX8,CMOS,TSSOP,48PIN,PLASTIC	IC,EEPROM,NOR FLASH,2MX16/4MX8,CMOS,BGA,48PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor
Reach Compliance Code	compliant	compliant	compliant	compliant
Is Samacsys	N	N	N	N
Maximum access time	120 ns	120 ns	120 ns	70 ns
Spare memory width	8	8	8	8
startup block	BOTTOM	BOTTOM	BOTTOM	BOTTOM
command user interface	YES	YES	YES	YES
Universal Flash Interface	YES	YES	YES	YES
Data polling	YES	YES	YES	YES
JESD-30 code	R-PBGA-B48	R-PDSO-G48	R-PDSO-G48	R-PBGA-B48
memory density	33554432 bit	33554432 bit	33554432 bit	33554432 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH
Number of departments/size	8,63	8,63	8,63	8,63
Number of terminals	48	48	48	48
word count	2097152 words	2097152 words	2097152 words	2097152 words
character code	2000000	2000000	2000000	2000000
Maximum operating temperature	85 °C	85 °C	125 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-55 °C	-40 °C
organize	2MX16	2MX16	2MX16	2MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	FBGA	TSSOP	TSSOP	FBGA
Encapsulate equivalent code	BGA48,6X8,32	TSSOP48,.8,20	TSSOP48,.8,20	BGA48,6X8,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, FINE PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	1.8/2.2 V	1.8/2.2 V	1.8/2.2 V	1.8/2.2 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ready/busy	YES	YES	YES	YES
Department size	8K,64K	8K,64K	8K,64K	8K,64K
Maximum standby current	0.000005 A	0.000005 A	0.000005 A	0.000005 A
Maximum slew rate	0.025 mA	0.025 mA	0.025 mA	0.025 mA
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	MILITARY	INDUSTRIAL
Terminal form	BALL	GULL WING	GULL WING	BALL
Terminal pitch	0.8 mm	0.5 mm	0.5 mm	0.8 mm
Terminal location	BOTTOM	DUAL	DUAL	BOTTOM
switch bit	YES	YES	YES	YES
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
Base Number Matches	1	1	1	1

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