|
SN74ABT574APWE4 |
SN74ABT574ARGYRG4 |
SN74ABT574APWRE4 |
SN74ABT574AZQNR |
SN74ABT574ANSRE4 |
SN74ABT574ADWE4 |
SN74ABT574ADBRE4 |
Description |
Flip Flops Octal Edge-Trig D-Ty F-F W/3-State Otpt |
Flip Flops Octal Edge-Trig D-Ty F-F W/3-State Otpt |
Flip Flops Octal Edge-Trig D-Ty F-F W/3-State Otpt |
Flip Flops Octal Edge-Trig D-Ty F-F W/3-State Otpt |
Flip Flops Octal Edge-Trig D-Ty F-F W/3-State Otpt |
Flip Flops Octal Edge-Trig D-Ty F-F W/3-State Otpt |
Flip Flops Octal Edge-Trig D-Ty F-F W/3-State Otpt |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Parts packaging code |
TSSOP |
QFN |
TSSOP |
BGA |
SOIC |
SOIC |
SSOP |
package instruction |
TSSOP, TSSOP20,.25 |
HVQCCN, LCC20/24,.14X.18,20 |
TSSOP, TSSOP20,.25 |
VFBGA, BGA20,4X5,25 |
SOP, SOP20,.3 |
SOP, SOP20,.4 |
SSOP, SSOP20,.3 |
Contacts |
20 |
20 |
20 |
20 |
20 |
20 |
20 |
Reach Compliance Code |
unknow |
unknow |
unknow |
compli |
unknow |
unknow |
unknow |
series |
ABT |
ABT |
ABT |
ABT |
ABT |
ABT |
ABT |
JESD-30 code |
R-PDSO-G20 |
R-PQCC-N20 |
R-PDSO-G20 |
R-PBGA-B20 |
R-PDSO-G20 |
R-PDSO-G20 |
R-PDSO-G20 |
length |
6.5 mm |
4.5 mm |
6.5 mm |
4 mm |
12.6 mm |
12.8 mm |
7.2 mm |
Logic integrated circuit type |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
Maximum Frequency@Nom-Su |
150000000 Hz |
150000000 Hz |
150000000 Hz |
150000000 Hz |
150000000 Hz |
150000000 Hz |
150000000 Hz |
MaximumI(ol) |
0.064 A |
0.064 A |
0.064 A |
0.064 A |
0.064 A |
0.064 A |
0.064 A |
Number of digits |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of ports |
2 |
2 |
2 |
2 |
2 |
2 |
2 |
Number of terminals |
20 |
20 |
20 |
20 |
20 |
20 |
20 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
Output polarity |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
HVQCCN |
TSSOP |
VFBGA |
SOP |
SOP |
SSOP |
Encapsulate equivalent code |
TSSOP20,.25 |
LCC20/24,.14X.18,20 |
TSSOP20,.25 |
BGA20,4X5,25 |
SOP20,.3 |
SOP20,.4 |
SSOP20,.3 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, SHRINK PITCH |
method of packing |
TUBE |
TAPE AND REEL |
TAPE AND REEL |
TAPE AND REEL |
TAPE AND REEL |
TUBE |
TAPE AND REEL |
Peak Reflow Temperature (Celsius) |
260 |
NOT SPECIFIED |
260 |
NOT SPECIFIED |
260 |
260 |
260 |
power supply |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
Maximum supply current (ICC) |
30 mA |
30 mA |
30 mA |
30 mA |
30 mA |
30 mA |
30 mA |
Prop。Delay @ Nom-Su |
7.1 ns |
7.1 ns |
7.1 ns |
7.1 ns |
7.1 ns |
7.1 ns |
7.1 ns |
propagation delay (tpd) |
7.1 ns |
7.1 ns |
7.1 ns |
7.1 ns |
7.1 ns |
7.1 ns |
7.1 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.2 mm |
1 mm |
1.2 mm |
1 mm |
2 mm |
2.65 mm |
2 mm |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
BICMOS |
BICMOS |
BICMOS |
BICMOS |
BICMOS |
BICMOS |
BICMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
GULL WING |
NO LEAD |
GULL WING |
BALL |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.65 mm |
0.5 mm |
0.65 mm |
0.65 mm |
1.27 mm |
1.27 mm |
0.65 mm |
Terminal location |
DUAL |
QUAD |
DUAL |
BOTTOM |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
Trigger type |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
width |
4.4 mm |
3.5 mm |
4.4 mm |
3 mm |
5.3 mm |
7.5 mm |
5.3 mm |
Is it lead-free? |
Lead free |
- |
Lead free |
- |
Lead free |
Lead free |
Lead free |
Other features |
BROADSIDE VERSION OF 374 |
- |
BROADSIDE VERSION OF 374 |
BROADSIDE VERSION OF 374 |
BROADSIDE VERSION OF 374 |
BROADSIDE VERSION OF 374 |
BROADSIDE VERSION OF 374 |
JESD-609 code |
e4 |
- |
e4 |
- |
e4 |
e4 |
e4 |
Humidity sensitivity level |
1 |
- |
1 |
- |
1 |
1 |
1 |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |