|
SN74HCT139DT |
SN74HCT139PWTE4 |
SN74HCT139NE4 |
SN74HCT139DTE4 |
SN74HCT139DBRE4 |
Description |
Encoders, Decoders, Multiplexers & Demultiplexers Dual 2 to 4-Line Decdr/Demltplxer |
Encoders, Decoders, Multiplexers & Demultiplexers Dual 2 to 4-Line Decdr/Demltplxer |
Encoders, Decoders, Multiplexers & Demultiplexers Dual 2 to 4-Line Decdr/Demltplxer |
Encoders, Decoders, Multiplexers & Demultiplexers Dual 2 to 4-Line Decdr/Demltplxer |
Encoders, Decoders, Multiplexers & Demultiplexers Dual 2 to 4-Line Decdr/Demltplxer |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Parts packaging code |
SOIC |
TSSOP |
DIP |
SOIC |
SOIC |
package instruction |
SOP, SOP16,.25 |
TSSOP, TSSOP16,.25 |
DIP, DIP16,.3 |
SOP, SOP16,.25 |
SSOP, SSOP16,.3 |
Contacts |
16 |
16 |
16 |
16 |
16 |
Reach Compliance Code |
compli |
unknow |
unknow |
unknow |
unknow |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
series |
HCT |
HCT |
HCT |
HCT |
HCT |
Input adjustment |
STANDARD |
STANDARD |
STANDARD |
STANDARD |
STANDARD |
JESD-30 code |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDIP-T16 |
R-PDSO-G16 |
R-PDSO-G16 |
JESD-609 code |
e4 |
e4 |
e4 |
e4 |
e4 |
length |
9.9 mm |
5 mm |
19.305 mm |
9.9 mm |
6.2 mm |
Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
Logic integrated circuit type |
OTHER DECODER/DRIVER |
OTHER DECODER/DRIVER |
OTHER DECODER/DRIVER |
OTHER DECODER/DRIVER |
OTHER DECODER/DRIVER |
MaximumI(ol) |
0.004 A |
0.004 A |
0.004 A |
0.004 A |
0.004 A |
Number of functions |
2 |
2 |
2 |
2 |
2 |
Number of terminals |
16 |
16 |
16 |
16 |
16 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Output polarity |
INVERTED |
INVERTED |
INVERTED |
INVERTED |
INVERTED |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
TSSOP |
DIP |
SOP |
SSOP |
Encapsulate equivalent code |
SOP16,.25 |
TSSOP16,.25 |
DIP16,.3 |
SOP16,.25 |
SSOP16,.3 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE, SHRINK PITCH |
method of packing |
TAPE AND REEL |
TAPE AND REEL |
TUBE |
TAPE AND REEL |
TAPE AND REEL |
Peak Reflow Temperature (Celsius) |
260 |
260 |
NOT SPECIFIED |
260 |
260 |
power supply |
5 V |
5 V |
5 V |
5 V |
5 V |
Prop。Delay @ Nom-Su |
43 ns |
43 ns |
43 ns |
43 ns |
43 ns |
propagation delay (tpd) |
43 ns |
43 ns |
43 ns |
43 ns |
43 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.75 mm |
1.2 mm |
5.08 mm |
1.75 mm |
2 mm |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
surface mount |
YES |
YES |
NO |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
GULL WING |
GULL WING |
THROUGH-HOLE |
GULL WING |
GULL WING |
Terminal pitch |
1.27 mm |
0.65 mm |
2.54 mm |
1.27 mm |
0.65 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
3.9 mm |
4.4 mm |
7.62 mm |
3.9 mm |
5.3 mm |
Humidity sensitivity level |
1 |
1 |
- |
1 |
1 |
Base Number Matches |
- |
1 |
1 |
- |
1 |