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FPC040P030-S

Description
FPC/FFC SMT CONN STENCIL
CategoryTools and equipment   
File Size497KB,11 Pages
ManufacturerChip Quik
Environmental Compliance
Download Datasheet Parametric View All

FPC040P030-S Overview

FPC/FFC SMT CONN STENCIL

FPC040P030-S Parametric

Parameter NameAttribute value
typeFPC/FFC
Number of pins30
spacing0.016"(0.40mm)
external dimensions0.900" long x 1.300" wide (22.86mm x 33.02mm)
Internal dimensions-
Thermal Center Pad0.157" long x 0.701" wide (4.00mm x 17.80mm)
MaterialStainless steel
thickness0.0040"(0.102mm)
AN0001
Application note revision 1.6
www.Proto-Advantage.com
Circuit Assembly Instructions for Proto Advantage PCB and Stencil Kits
1.0 Board and Stencil Kit Details
Whether you have a toaster oven, a hot plate, or a professional reflow oven, use our laser cut 4 mil (0.1 mm) thick
stainless steel stencils to apply paste and reflow any surface mount chip. All you need is one of our adapter
boards (example: PA*, IPC*, or FPC*), the corresponding stencil (example: PA*-S, IPC*-S, or FPC*-S), one of our
mini-squeegees, and one of our mini-tubes of solder paste. We manufacture and stock the largest selection of
adapter boards in the world, and can adapt almost any IC package to DIP.
For the demonstration in this application note, we have used a low cost toaster oven. Usually the cheaper ones
are best since they have manual controls. This one has a manual control knob allowing temperature to be set
from 95°C (200°F) to 235°C (450°F), perfect for a low temperature (Sn42/Bi57.6/Ag0.4) or leaded (Sn63/Pb37)
reflow process. For prototypes, we usually recommend low temperature or leaded solder paste as it makes reflow
easier due to the lower liquidus temperatures. Most lead-free packages are backwards compatible with a low
temperature or leaded solder process. The only exception being lead-free BGA packages, which can still be
soldered using a low temperature or leaded process, but require a higher liquidus temperature, usually around
217°C (420°F), to be exceeded for at least 30 seconds to ensure the lead-free solder balls melt.
Figure 1 below shows the syringe of solder paste, IPC* adapter board, stainless steel stencil (4 mil thick), and
mini-squeegee for reflowing ICs in the lab, at work, or at home. Figure 2 shows the other equipment you will
need: isopropyl alcohol, paper towels (or lint free wipes if you have them), toaster oven, temperature probe,
compressed air (optional), tweezers and Scotch® tape.
Figure 1:
Proto Advantage Board and Stencil Kit.
Figure 2:
Other equipment you will need.
1
© 2007-2016 Proto Advantage
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