HEATSINK 57.9X60.96X5.84MM T766
Parameter Name | Attribute value |
type | top installation |
cooling package | Classification (BGA, LGA, CPU, ASIC...) |
Joining method | Push your feet |
shape | rectangular, fins |
length | 2.280"(57.90mm) |
width | 2.400"(60.96mm) |
diameter | - |
Height from base (fin height) | 0.230"(5.84mm) |
Power dissipation at different temperature rises | - |
Thermal resistance at different forced airflows | 18.94°C/W @ 100 LFM |
Thermal resistance under natural conditions | - |
Material | aluminum |
Material plating | blue anodized |